Cadence Wins Four 2020 TSMC OIP Partner of the Year Awards
November 02 2020 - 10:45AM
Business Wire
Cadence achieves recognition for joint
development of N3 design infrastructure, 3D-IC design productivity
solution, timing signoff in the cloud design solution and DSP
IP
Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that
it has received four OIP Partner of the Year awards from TSMC for
IP and EDA solutions. Cadence achieved recognition for the joint
development of the N3 design infrastructure, 3D-IC design
productivity solution, timing signoff in the cloud design solution
and DSP IP.
These awards were given to Cadence based on the following work
that has been delivered:
- N3 design infrastructure: Cadence participated in an
in-depth collaboration with TSMC on the design infrastructure
development of this advanced process technology and has been
working with customers using the Cadence® Virtuoso® Custom IC
design platform and a full suite of digital design, implementation
and signoff tools anchored by the Innovus™ Implementation System
and Genus™ Synthesis Solution on N3 production designs.
- 3D-IC design productivity solution: Cadence collaborated
with TSMC on significant productivity enhancements to design
solutions for the latest TSMC 3DFabric™ packaging technologies,
delivering certified and enhanced reference flows for InFO and
CoWoS® that include a full suite of Cadence multi-chip and chiplet
advanced package planning, layout, verification and electrical
analysis, including the Clarity™ 3D Solver for 3D electromagnetic
modeling for CoWoS designs.
- Timing signoff in the cloud design solution: Cadence
further expanded its cloud collaboration with TSMC by demonstrating
methodologies to accelerate timing signoff with the Cadence Tempus™
Timing Signoff Solution via the Cadence CloudBurst™ Platform,
showing scalability on 150 machines for the fastest turnaround time
and methods that reduce timing-signoff machine costs by 2X. Also,
Cadence successfully delivered secure cloud-based environments for
universities creating advanced-node designs and teaming with TSMC’s
Cloud Alliance partners to provide a design environment for TSMC’s
first-ever IC Layout Contest. Each of these areas leveraged the
CloudBurst Platform to meet TSMC’s Virtual Design Environment (VDE)
requirements.
- DSP IP: Cadence worked with TSMC’s Soft IP9000 team to
certify Cadence Tensilica® DSP IP in the TSMC integration
flow.
“We’ve consistently worked with Cadence to enable our mutual
customers to achieve the best possible design results,” said Suk
Lee, senior director of the Design Infrastructure Management
Division at TSMC. “We look forward to seeing our customers leverage
the design solutions using our latest advanced technologies to
deliver new silicon innovations with fast time-to-market in their
respective markets.”
“Through our ongoing collaboration with TSMC, we’re enabling
mutual customers to deliver designs with confidence and meet design
goals using our newest technologies,” said Dr. Chin-Chi Teng,
senior vice president and general manager of the Digital &
Signoff Group at Cadence. “These prestigious awards from TSMC
further indicate Cadence’s commitment to delivering upon its
Intelligent System Design strategy, which enables customers to
achieve SoC design excellence across a variety of key market areas
ranging from hyperscale computing to consumer segments.”
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design™ strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications,
including consumer, hyperscale computing, 5G communications,
automotive, mobile, aerospace, industrial and healthcare. For six
years in a row, Fortune magazine has named Cadence one of the 100
Best Companies to Work For. Learn more at cadence.com.
© 2020 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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