Cadence and UMC Certify mmWave Reference Flow on 28HPC+ Process for Advanced RF Designs
July 23 2020 - 10:45AM
Business Wire
Collaboration enables customers to utilize
Cadence RF solutions to design 5G, IoT and automotive applications
on UMC’s 28nm process technology
Cadence Design Systems, Inc. (Nasdaq: CDNS) and United
Microelectronics Corporation (UMC), a global semiconductor foundry,
today announced that the Cadence® millimeter wave (mmWave)
reference flow has achieved certification for UMC’s 28HPC+ process
technology. With this certification, mutual Cadence and UMC
customers have access to an integrated RF design flow that
accelerates time to market. The complete mmWave reference flow,
based on UMC’s Foundry Design Kit (FDK), includes an actual
demonstration circuit with a highly automated circuit design,
layout, signoff and verification flow that provides more seamless
design in 28HPC+.
The certified mmWave reference flow supports the Cadence
Intelligent System Design™ strategy, which enables customers to
achieve SoC design excellence. To learn more about the Cadence RF
solutions that support the UMC 28HPC+ process technology, visit
www.cadence.com/go/CadenceRFSolutions.
High-frequency mmWave RF designs require accurate
electromagnetic (EM) extraction and simulation analysis in addition
to analog and mixed-signal capabilities. The mmWave reference flow,
based on the Cadence Virtuoso® RF solution, brings together the
industry-leading schematic capture, layout implementation,
parasitic extraction, EM analysis and RF circuit simulation, along
with integrated layout versus schematic (LVS) and design rule
checking (DRC) in a single flow. This flow also incorporates EM
analysis using the Cadence EMX® Planar 3D Simulator and Cadence
AWR® AXIEM® 3D Planar EM Analysis into the trusted Virtuoso and
Spectre® platforms, providing a high level of automation and the
ability to analyze performance of RF circuits pre- and
post-silicon.
The certified mmWave reference flow includes:
- Design capture and simulation via the Virtuoso Schematic
Editor, Virtuoso ADE Explorer and Assembler, Spectre X Simulator,
Spectre AMS Designer and the Spectre RF Option
- Layout implementation via the Virtuoso Layout Suite and
Physical Verification System (PVS)
- Parasitic extraction of transistor-level interconnects
via the Quantus™ Extraction Solution
- Electromagnetic analysis of interconnects across transistors
including passive RF structures via the EMX or AWR AXIEM 3D
Planar simulators
“Through our collaboration with UMC, our mutual customers can
now take advantage of the most advanced features within the
industry-leading Virtuoso and Spectre platforms while leveraging
our EMX and AWR AXIEM integrated EM solvers for designing 5G, IoT
and automotive applications,” said KT Moore, vice president,
product management in the Custom IC & PCB Group at Cadence.
“This flow allows engineers using the UMC 28HPC+ process technology
to more accurately predict circuit performance in silicon, which is
critical for meeting productivity and time-to-market goals.”
With its AEC Q100 automotive grade-1 platform solution, UMC's
production-proven 28HPC+ solution is able to serve a complete range
of applications, from digital to mmWave. 28HPC+ utilizes a
high-performance High-k/Metal Gate stack, and UMC further extends
its SPICE model coverage to 110GHz for mmWave in order to serve
mobile phone, automotive/industrial radar and 5G FWA/CPE
applications. Customers can leverage UMC's mmWave FDK to design a
transceiver IC, or integrate the foundry’s well-established digital
and analog IP to accelerate their mmWave SoC design.
“We’ve developed a comprehensive mmWave reference flow with
Cadence that utilizes their comprehensive RF design flow in
conjunction with a UMC foundry kit so engineers can create
accurate, innovative designs using our 28HPC+ process technology,”
said T.H. Lin, director of IP Development and Design Support at
UMC. “Leveraging the flow capabilities and the familiar Virtuoso
design environment, customers can minimize iterations and deliver
designs based on our 28nm technology much more efficiently.”
About Cadence
Cadence is a pivotal leader in electronic design, building upon
more than 30 years of computational software expertise. The company
applies its underlying Intelligent System Design strategy to
deliver software, hardware and IP that turn design concepts into
reality. Cadence customers are the world’s most innovative
companies, delivering extraordinary electronic products from chips
to boards to systems for the most dynamic market applications
including consumer, hyperscale computing, 5G communications,
automotive, aerospace, industrial and health. For six years in a
row, Fortune Magazine has named Cadence one of the 100 Best
Companies to Work For. Learn more at cadence.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry. The company provides high quality IC production with a
focus on both logic and specialty technologies to serve every major
sector of the electronics industry. UMC’s comprehensive technology
and manufacturing solutions include logic/RF, embedded high
voltage, embedded flash, RFSOI/BCD and IATF-16949 automotive
manufacturing certification for all its manufacturing facilities.
UMC operates 12 fabs that are strategically located throughout Asia
with a maximum capacity of more than 750,000 8-inch equivalent
wafers per month. The company employs approximately 19,000 people
worldwide, with offices in Taiwan, China, United States, Europe,
Japan, Korea and Singapore. For more information, please visit:
http://www.umc.com.
Note from UMC Concerning Forward-Looking Statements
Some of the statements in the foregoing announcement are
forward-looking within the meaning of the U.S. Federal Securities
laws, including statements about introduction of new services and
technologies, future outsourcing, competition, wafer capacity,
business relationships and market conditions. Investors are
cautioned that actual events and results could differ materially
from these statements as a result of a variety of factors,
including conditions in the overall semiconductor market and
economy; acceptance and demand for products from UMC; and
technological and development risks. Further information regarding
these and other risks is included in UMC’s filings with the U.S.
Securities and Exchange Commission. UMC does not undertake any
obligation to update any forward-looking statement as a result of
new information, future events or otherwise, except as required
under applicable law.
© 2020 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. All other trademarks are
the property of their respective owners.
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Cadence Newsroom 408-944-7039 newsroom@cadence.com
UMC Richard Yu (886) 2-2658-9168 ext. 16951
richard_yu@umc.com
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