Cadence 3D-IC Advanced Packaging Integration Flow Certified by Samsung Foundry for its 7LPP Process Technology
October 17 2019 - 10:45AM
Business Wire
Cadence full flow enables the planning,
implementation and analysis of advanced multi-die and chiplet-based
IC packaging
Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that
the complete, integrated Cadence® 3D-IC advanced packaging
integration flow has achieved certification for the Samsung Foundry
MDI™ (Multi-Die-Integration) packaging flow based on the 7nm Low
Power Process (7LPP) technology. The reference flow was developed
in close collaboration with Samsung Foundry to provide mutual
customers with a full planning, implementation and analysis flow
for 3D multi-die packages. For more information on the Cadence
tools that support the Samsung Foundry MDI packaging technology,
please visit www.cadence.com/go/3dicspr.
The use of multiple stacked chips in a single package is
becoming a key trend for mobile, IoT and data center designs, which
is also extending into the AI and 5G market segments due to the
rapid and efficient integration of complete functions that can be
implemented via the optimal process node into a system in package
(SiP). The Cadence technology provides customers with analysis,
implementation and physical verification capabilities within a
single canvas and offers unique, early-stage system-level
pathfinding and highly-complex design capabilities for 3D signoff.
The Cadence flow has been optimized to enable customers to achieve
all the benefits the Samsung Foundry MDI packaging technology has
to offer in order to deliver new products to market with greater
speed and agility.
“Mutual customers addressing various types of design sizes and
complexities can benefit from the new MDI flow based on Cadence’s
flexible suite of advanced 3D packaging tools, which aims to
support the integration of multiple application-specific die and
chiplets into a single packaged device that is optimized for their
target application,” said Jung Yun Choi, vice president of Foundry
Design Technology Team at Samsung Electronics. “This collaboration
between Cadence and Samsung provides customers with both reduction
in cost and turnaround time through the accurate, broad analysis of
system-level and complex interconnects.”
A full suite of Cadence digital and signoff as well as IC
package and PCB analysis tools have been optimized for the Samsung
MDI technology to guarantee seamless integration for handling
multiple dies including the Innovus™ Implementation System,
Quantus™ Extraction Solution, Tempus™ Timing Signoff Solution,
Voltus™ IC Power Integrity Solution, OrbitIO™ interconnect
designer, SiP Layout, Sigrity™ XtractIM™ technology, Sigrity
XcitePI™ technology, Sigrity SystemSI™ technology, and Sigrity
PowerDC™ technology.
“This is an example of how, through our continued partnership
with Samsung Foundry, we’re developing innovative solutions for our
mutual customers,” said KT Moore, vice president, product
management, Digital & Signoff Group at Cadence. “This seamless
3D integrated flow developed by Cadence and Samsung Foundry enables
our customers to design multi-die offerings in a single integrated
environment, enabling the delivery of complex products much
faster.”
The Cadence 3D-IC packaging flow provides a fast path to design
closure and supports the company’s overall Intelligent System
Design™ strategy, enabling advanced-node system-on-chip (SoC)
design excellence.
About Cadence
Cadence enables electronic systems and semiconductor companies
to create the innovative end products that are transforming the way
people live, work and play. Cadence’s software, hardware and
semiconductor IP are used by customers to deliver products to
market faster. The company’s Intelligent System Design strategy
helps customers develop differentiated products—from chips to
boards to intelligent systems—in mobile, consumer, cloud, data
center, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine's 100 Best
Companies to Work For. Learn more at cadence.com.
© 2019 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. in the US and/or
elsewhere. All other trademarks are the property of their
respective owners.
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