Cadence Launches Celsius Thermal Solver, Delivering the Industry’s First Complete Electrical-Thermal Co-Simulation for Syst...
September 17 2019 - 07:00PM
Business Wire
Innovative multi-physics technology furthers
Cadence’s expansion into fast-growing system analysis and design
market
Highlights:
- Massively parallel execution delivers up to 10X faster
performance than existing solutions without compromising
accuracy
- Transient as well as steady-state analysis enable accurate
electrical-thermal co-simulation
- Combination of finite element analysis (FEA) and computational
fluid dynamics (CFD) provides total system analysis
- Integration with Cadence IC, package and PCB implementation
platforms accelerates and simplifies design iterations
Cadence Design Systems, Inc. (NASDAQ: CDNS) today expanded its
presence in the system analysis and design market with the
introduction of the Cadence® Celsius™ Thermal Solver, the
industry’s first complete electrical-thermal co-simulation solution
for the full hierarchy of electronic systems from ICs to physical
enclosures. Following the successful launch of the Clarity™ 3D
Solver earlier this year, the Celsius Thermal Solver is the second
innovative product in Cadence’s new system analysis initiative.
Based on a production-proven, massively parallel architecture that
delivers up to 10X faster performance than legacy solutions without
sacrificing accuracy, the Celsius Thermal Solver seamlessly
integrates with Cadence IC, package and PCB implementation
platforms. This enables new system analysis and design insights and
empowers electrical design teams to detect and mitigate thermal
issues early in the design process—reducing electronic system
development iterations. For more information, please visit
www.cadence.com/go/celsiusthermalsolver.
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A temperature profile of 3D structures
inside a package with metal interconnects, as generated by the
Cadence® Celsius™ Thermal Solver (Graphic: Business Wire)
IC and electronic systems companies, particularly those
incorporating 3D-IC packaging, face tremendous thermal challenges
that can cause late-stage design modifications and iterations and
derail project schedules. As the electronics industry moves toward
smaller, faster, smarter and more complex products with greater
power density, time-consuming thermal transient analysis techniques
must be deployed together with traditional steady-state analysis to
address multiple power profiles and increased heat dissipation.
Further complicating the process, traditional simulators require
the electronics and enclosures being modeled to be substantially
simplified, resulting in reduced accuracy.
The Celsius Thermal Solver utilizes innovative multi-physics
technology to address these challenges. By combining finite element
analysis (FEA) for solid structures with computational fluid
dynamics (CFD) for fluids, the Celsius Thermal Solver enables
complete system analysis in a single tool. When using the Celsius
Thermal Solver in conjunction with the Clarity 3D Solver, Voltus™
IC Power Integrity and Sigrity™ technology for PCB and IC
packaging, engineering teams can combine electrical and thermal
analysis and simulate the flow of both electricity and heat for a
more accurate system-level thermal simulation than legacy tools. In
addition, the Celsius Thermal Solver performs both static
(steady-state) and dynamic (transient) electrical-thermal
co-simulations based on the actual flow of electrical power in
advanced 3D structures, providing visibility into real-world system
behavior.
By empowering electronics design teams to analyze thermal issues
early and share ownership of thermal analysis, the Celsius Thermal
Solver reduces design re-spins and enables new analysis and design
insights not possible with legacy solutions. In addition, the
Celsius Thermal Solver accurately simulates large systems with
detailed granularity for any object of interest and is the first
solution capable of modeling structures as small as the IC and its
power distribution together with structures as large as the
chassis.
The Celsius Thermal Solver supports Cadence’s Intelligent System
Design™ strategy, enabling system innovation. It is built on matrix
solver technology that is production proven in the recently
announced Clarity 3D Solver and the Voltus IC Power Integrity
Solution. Optimized for cloud environments, the Celsius Thermal
Solver’s massively parallel architecture delivers up to 10X cycle
time improvements compared to legacy solutions with high accuracy
and unlimited scalability.
“As part of our Intelligent System Design strategy, Cadence is
applying our extensive computational software expertise to new
system innovations that address critical customer pain points,”
said Tom Beckley, senior vice president and general manager, Custom
IC & PCB Group at Cadence. “Following the highly successful
launch of our Clarity 3D Solver earlier this year, the Celsius
Thermal Solver helps our customers overcome the crucial challenge
of system design and analysis of thermal effects and furthers
Cadence’s expansion into new system domains.”
Endorsements
“In the automotive electronics industry, we depend on precise
electro-thermal simulations to develop world-class automotive ASICs
and system-in-package components,” said Goeran Jerke, senior
project manager EDA Research and Advance Development, Automotive
Electronics division at Robert Bosch GmbH. “The Cadence Celsius
Thermal Solver is tightly integrated with the Virtuoso platform,
which makes electro-thermal simulations easily and directly
accessible to advanced circuit, layout and package designers. The
Celsius Thermal Solver offers fast turnaround times and accurate
results. We will be able to explore more design variants and to
utilize electro-thermal simulation for new use cases that, until
recently, were out of reach.”
“Advanced packaging techniques such as 3D-IC and face-to-face
wafer bonding enhance the performance of electronic systems from
mobile to high-performance computing applications, but bring new
design challenges from the strong coupling between electrical and
thermal effects,” said Vicki Mitchell, vice president of systems
engineering, Central Engineering Group, Arm. “The addition of the
Celsius Thermal Solver to Cadence’s system analysis portfolio
allows our mutual customers to deliver next-generation electronic
systems because we are now able to support thermal and electrical
co-simulation in our design flows.”
Availability
The Celsius Thermal Solver is currently being used in production
by select customers and is in general availability now.
About Cadence
Cadence enables electronic systems and semiconductor companies
to create the innovative end products that are transforming the way
people live, work and play. Cadence software, hardware and
semiconductor IP are used by customers to deliver products to
market faster. The company’s Intelligent System Design strategy
helps customers develop differentiated products—from chips to
boards to intelligent systems—in mobile, consumer, cloud, data
center, automotive, aerospace, IoT, industrial and other market
segments. Cadence is listed as one of Fortune Magazine’s 100 Best
Companies to Work For. Learn more at cadence.com.
© 2019 Cadence Design Systems, Inc. All rights reserved
worldwide. Cadence, the Cadence logo and the other Cadence marks
found at www.cadence.com/go/trademarks are trademarks or registered
trademarks of Cadence Design Systems, Inc. Arm is a registered
trademark of Arm Limited (or its subsidiaries) in the US and/or
elsewhere. All other trademarks are the property of their
respective owners.
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