PITTSBURGH, March 19, 2021 /PRNewswire/ --
/ Key Highlight
- Attendees at TSMC 2020 Open Innovation Platform (OIP)
Ecosystem Forum North America voted for Ansys' paper to win the
Customers' Choice Award
- Ansys' paper highlighted Ansys Totem's technology for
analyzing 5G Radio Frequency (RF) devices
Ansys (NASDAQ: ANSS) received the Customers' Choice Award
for a technical paper presented at TSMC 2020 North America Open
Innovation Platform® (OIP) Ecosystem Forum. Within the paper, Ansys
provided a roadmap for adding new technology to the Ansys®
Totem™ RF design solution to address challenges in
next-generation communication technologies beyond 5G, enabling
customer success. The paper won the award based on the popular vote
by conference attendees and can be downloaded on
TSMC.com.
Transitioning to 5G millimeter wave wireless communication
requires massive integration of RF components into digital SoCs
(System-on-Chip). RF devices consume significant power and the
resulting electromigration and self-heating challenges
significantly impact the efficiency, cost and reliability of
high-speed designs, which must be comprehensively addressed. Ansys
enhanced Totem's capabilities to address the needs of 5G and
high-speed RF designers.
Ansys' paper, titled "Electromigration and Self-Heat Analysis on
RF Devices for mmWave Designs," details how Totem empowers 5G and
high-speed RF designers to conduct electromigration and self-heat
analysis. The Totem electromigration flow was demonstrated on an RF
block using TSMC 16nm process technology and has been validated by
TSMC.
"As a valued partner, Ansys provides leading design solutions
that enable our mutual customers to take advantage of TSMC's latest
process technologies," said Suk Lee,
vice president of the Design Infrastructure Management Division at
TSMC. "We are pleased to congratulate Ansys as the winner of this
Customers' Choice Award and look forward to our continued
collaboration with Ansys to address future complex challenges for
designing next-generation silicon technologies."
"Together with TSMC, Ansys continues to help engineers overcome
significant hurdles for designing 5G and high-speed RF chips," said
John Lee, vice president and general
manager at Ansys. "Receiving this prestigious award from TSMC for
the second time in three years is a testament to the impact our
industry-leading simulation solutions have made on the design
community and we intend to deepen our collaboration with TSMC to
solve more challenges in the near future."
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
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Contacts
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Media
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Mary Kate
Joyce
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724.820.4368
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marykate.joyce@ansys.com
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Investors
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Kelsey
DeBriyn
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724.820.3927
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kelsey.debriyn@ansys.com
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SOURCE Ansys