PITTSBURGH, Oct. 23, 2020 /PRNewswire/ --
/ Key Highlights
- Ansys secured an award in the category of Joint Development of
3nm Design Infrastructure for delivering foundry-certified,
state-of-the-art power integrity and electromigration signoff
verification tools for TSMC's 3nm process technology
- Ansys earned an award in the category of Joint Development of
3D-IC Design Productivity Solution for providing a
foundry-certified advanced semiconductor design for TSMC's 3D-IC
advanced packaging technologies
TSMC awarded Ansys (NASDAQ: ANSS) two Open Integration Platform
(OIP) Partner of the Year awards. Ansys' multiphysics simulation
solutions for TSMC's world-class 3nm process and highly
sophisticated three-dimensional integrated circuit (3D-IC) advanced
packaging technologies help mutual customers speed the design of
smartphone, high-performance computing, automotive and Internet of
Things systems.
Ansys secured an award in the category of Joint Development of
3nm Design Infrastructure for delivering Ansys®
RedHawk-SC™ and Ansys® Totem™.
These foundry-certified, state-of-the-art power integrity and
electromigration signoff tools were optimized for TSMC's 3nm
process technology, enabling customers to satisfy key power,
thermal and reliability requirements for cutting-edge
applications.
Additionally, Ansys earned an award in the category of Joint
Development of 3D-IC Design Productivity Solution for providing
Ansys® RedHawk™, Ansys® RedHawk-SC
Electrothermal™ and Ansys®
RaptorH™. These advanced semiconductor analysis tools
were certified for the latest variant of TSMC's high-speed,
leading-edge CoWoS® and InFO 3D-IC packaging
technologies, empowering customers to simulate and alleviate power
and thermal reliability issues and to achieve optimal electrical
performance.
"We're pleased to congratulate Ansys as the winner of two 2020
TSMC OIP Partner of the Year awards. These awards are a testament
to their delivery of multiphysics simulation solutions that enable
customer design success, benefitting from the significant power and
performance boost of TSMC's latest and most advanced technologies,"
said Suk Lee, senior director of
Design Infrastructure Management Division at TSMC. "Together, we
will continue to overcome customers' design challenges and speed
breakthrough silicon innovations with increased confidence."
"Mutual customers rely on Ansys' industry-leading simulation
solutions to ensure maximum electronics system performance and
reliability for next-generation system-on-chip architectures
and groundbreaking 3D-IC design solutions," said John Lee, vice president and general manager at
Ansys. "Receiving two TSMC OIP Partner of the Year awards for 3nm
and 3DIC design solutions reflects our long-time role as a trusted
signoff partner for TSMC's latest technologies and Ansys is
committed to continuing that tradition, helping TSMC drive
development of new silicon systems for highly innovative
applications."
/ About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS–T
/ Contacts
Media
|
Mary Kate
Joyce
|
|
724.820.4368
|
|
marykate.joyce@ansys.com
|
|
|
Investors
|
Annette N. Arribas,
IRC
|
|
724.820.3700
|
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annette.arribas@ansys.com
|
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SOURCE Ansys