PITTSBURGH, Aug. 26, 2020 /PRNewswire/ --
Key Highlights
- Ansys achieved certification of its advanced semiconductor
design solution for TSMC's high-speed CoWoS®
(Chip-on-Wafer-on-Substrate) and InFO (Integrated Fan-Out) 2.5D and
3D advanced packaging technologies
- Ansys' comprehensive suite of power, thermal and signal
integrity analysis engines simulate, calculate and alleviate
reliability issues, enabling optimal electrical performance
Ansys (NASDAQ: ANSS) achieved certification of its advanced
semiconductor design solution for TSMC's high-speed
CoWoS® with silicon interposer (CoWoS®-S) and
InFO with RDL interconnect (InFO-R) advanced packaging
technologies. This empowers customers to signoff power, signal
integrity and analyze the impact of thermal effects to confirm the
reliability of complete, integrated 2.5D and 3D silicon
systems.
TSMC certifies the Ansys® RedHawk™ and
Ansys® RaptorH™ family of multiphysics
solutions – including Ansys® Redhawk-SC
Electrothermal™ – for next-generation CoWoS®-S and
InFO-R advanced packaging technologies. The certification
encompasses die and package co-simulation and co-analysis for
extraction, power and signal integrity analysis, power and signal
electromigration (EM) analysis and thermal analysis. This
comprehensive suite of power, thermal, signal integrity and EM
analysis tools will help simulate, calculate and alleviate
reliability issues, enabling optimal electrical
performance.
"The result of our collaboration combining Ansys' multiphysics
solutions and TSMC's CoWoS® and InFO advanced packaging
technologies helps our mutual customers address their design
complexity and challenges," said Suk
Lee, senior director of the Design Infrastructure Management
Division at TSMC. "Through our ongoing partnership with Ansys,
customers can improve and validate their cutting-edge designs to
satisfy stringent performance and reliability standards."
"To meet demanding reliability requirements for Wi-Fi systems,
5G mobile devices and high-speed wireless components, customers
require a comprehensive multiphysics simulation solution that
addresses power, reliability, and thermal issues across the entire
chip, package and system," said John
Lee, vice president and general manager, Ansys.
"Collaborating with TSMC, our mutual customers will circumvent
these challenges, enable first-time design success and expedite
time to market with our leading-edge multiphysics simulation
platform."
About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys
is the global leader in engineering simulation. Through our strategy of Pervasive Engineering Simulation, we help the world's most
innovative companies deliver radically better products to their
customers. By offering the best and broadest portfolio of
engineering simulation software, we help them solve the most
complex design challenges and create products limited only by
imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS – T
Contacts
|
|
Media
|
Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
|
|
|
Investors
|
Annette N. Arribas,
IRC
724.820.3700
annette.arribas@ansys.com
|
View original content to download
multimedia:http://www.prnewswire.com/news-releases/ansys-multiphysics-solutions-certified-by-tsmc-for-high-speed-next-generation-3d-ic-packaging-technologies-301118481.html
SOURCE Ansys