PITTSBURGH, Aug. 25, 2020 /PRNewswire/ --
Key Highlights
- Ansys® RedHawk-SC™ is certified for
TSMC's advanced 3nm process technology
- Ansys' comprehensive power, thermal, and reliability analysis
enables mutual customers to meet key requirements for innovations
in artificial intelligence/machine learning (AI/ML), 5G,
high-performance computing (HPC), networking and autonomous vehicle
applications
Ansys (NASDAQ: ANSS) achieved certification of its
state-of-the-art multiphysics signoff solution for TSMC's most
advanced 3nm process technology. This enables mutual customers to
satisfy key power, thermal and reliability requirements for the
world's largest AI/ML, 5G, HPC, networking and autonomous vehicle
chips.
Achieving power integrity and electromigration (EM) reliability
for 3nm process technology remains a challenging signoff milestone.
Traditional discrete EM and voltage-drop methodologies are no
longer sufficient for signoff of the 3nm process, which integrates
billions of transistors and delivers tremendous power and
performance on a single die. 3nm requires a comprehensive power
integrity, thermal integrity, and reliability analysis platform
that Ansys delivers with Ansys RedHawk-SC and Ansys® Totem™.
The certification of RedHawk-SC for TSMC N3 process encompasses
power network extraction, power integrity and reliability, signal
EM, thermal reliability analysis for self-heat, thermal-aware EM
and statistical EM budgeting. Redhawk-SC will analyze huge 3nm
network designs by leveraging the elastic compute, big-data
analytics and high capacity of its underlying Ansys®
SeaScape™ infrastructure. Totem is similarly
certified for transistor-level custom designs.
"We're pleased with the result of our latest collaboration with
Ansys in providing multiphysics design solutions on TSMC's most
advanced 3nm process technology to help our mutual customers
address the design complexity and technical challenges," said
Suk Lee, Senior Director of the
Design Infrastructure Management Division at TSMC. "This joint
effort combining Ansys' cutting-edge solution and TSMC's advanced
process helps our customers unleash their silicon innovations for
next-generation 3nm chipsets that will power many
applications."
"The latest certification continues Ansys' close collaboration
with TSMC to pioneer solutions for our joint customers," said
John Lee, vice president and general
manager, Ansys. "Ansys' broad range of multiphysics simulation and
analysis technologies — from chip-level to system-level — makes us
ideally placed to enable larger designs with lower power
requirements for AI/ML, 5G, HPC, networking and image processing
applications."
About Ansys
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge or put on wearable technology, chances are you've used a
product where Ansys software played a critical role in its
creation. Ansys is the global leader in engineering simulation.
Through our strategy of Pervasive Engineering Simulation, we help
the world's most innovative companies deliver radically better
products to their customers. By offering the best and broadest
portfolio of engineering simulation software, we help them solve
the most complex design challenges and create products limited only
by imagination. Founded in 1970, Ansys is headquartered south of
Pittsburgh, Pennsylvania, U.S.A.
Visit www.ansys.com for more information.
Ansys and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries. All
other brand, product, service and feature names or trademarks are
the property of their respective owners.
ANSS – T
Contacts
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Media
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Mary Kate
Joyce
724.820.4368
marykate.joyce@ansys.com
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Investors
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Annette N. Arribas,
IRC
724.820.3700
annette.arribas@ansys.com
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SOURCE Ansys