Aehr Receives $1.4 Million in Orders for Full-Wafer WaferPak™ Contactors for Production Test and Burn-in of Sili...
June 29 2021 - 7:30AM
Aehr Test Systems (NASDAQ: AEHR), a worldwide
supplier of semiconductor test and reliability qualification
equipment, today announced it has received orders
totaling $1.4 million for WaferPak™ Contactors from
its lead silicon carbide customer for production
test and burn-in of the customer’s line of silicon
carbide devices. The orders include additional WaferPaks
to meet production capacity of previously designed and qualified
WaferPaks as well as another new silicon carbide design win.
This customer is a leading Fortune 500 supplier of semiconductor
devices with a significant customer base in the automotive
semiconductor market, and is using Aehr’s FOX-XP™ system’s unique
test and burn-in capabilities to ensure the highest device quality
for high volume production burn-in and infant mortality screening
of silicon carbide devices at wafer level for electric vehicle
power modules.
Gayn Erickson, President and CEO of Aehr Test Systems,
commented, “These orders from our lead silicon carbide
customer for our proprietary WaferPak Contactors
accompanies the order we announced on June 1st for
an additional FOX-XP™ production
test system and reflects their increased high
volume production capacity needs. This FOX-XP
system is configured to test eighteen silicon carbide
wafers in parallel while contacting and testing 100% of the devices
on each wafer. These WaferPaks enable the FOX-XP system to make
electrical and thermal contact to the silicon carbide wafer and not
only test and burn-in 100% of the devices on each wafer in
parallel, but also accurately monitor the temperature of each
WaferPak to ensure that the wafer under test is getting to the
correct burn-in conditions as well as apply and monitor the
electrical conditions on each and every device independently. This
allows us to guarantee that each device is properly tested and
burned in as well as determine exactly when a device fails in
time.
“Being able to ensure a valid test and burn-in of these silicon
carbide devices and monitor exactly when a device fails is critical
to being able to provide the quality and reliability needed to
address several markets, but particularly for the electric vehicle
market that is about to see incredible growth. We expect this
customer will order a significant number of FOX™ systems, WaferPaks
and related consumables that they have forecasted to purchase from
Aehr over the next several years.
“Silicon carbide continues to be promising as a key growth
driver for Aehr, and we anticipate that silicon carbide wafer level
burn-in will become the industry standard for low cost and 100%
traceability for burn-in and reliability screening. The power
semiconductor market for electric vehicles is expected to triple
between 2020 and 2026, growing at a 25.7% CAGR to $5.6 billion,
according to a March 2021 report from Yole Développement research.
In addition, a July 2020 report from Deloitte forecasts total EV
sales will grow from 2.5 million in 2020 to 11.2 million in
2025, a CAGR of 29%, before reaching 31.1 million by 2030 and
securing approximately 32% of the total market share for new
car sales.”
The FOX-XP system, available with multiple
WaferPak™ Contactors (full wafer test) or multiple
DiePak™ Carriers (singulated die/module test) configurations,
is capable of functional test and burn-in/cycling of integrated
devices such as silicon carbide power devices, silicon photonics as
well as other optical devices, 2D and 3D sensors, flash memories,
Gallium Nitride (GaN), magnetic sensors, microcontrollers, and
other leading-edge ICs in either wafer formfactor, before they are
assembled into single or multi-die stacked packages, or in
singulated die or module form factor.
About Aehr Test SystemsHeadquartered in
Fremont, California, Aehr Test Systems is a worldwide provider of
test systems for burning-in and testing logic, optical and memory
integrated circuits and has installed over 2,500 systems worldwide.
Increased quality and reliability needs of the Automotive and
Mobility integrated circuit markets are driving additional test
requirements, incremental capacity needs, and new opportunities for
Aehr Test products in package, wafer level, and singulated
die/module level test. Aehr Test has developed and introduced
several innovative products, including the ABTS™ and
FOX-P™ families of test and burn-in systems and FOX
WaferPak™ Aligner, FOX-XP WaferPak Contactor, FOX DiePak®
Carrier and FOX DiePak Loader. The ABTS system is used in
production and qualification testing of packaged parts for both
lower power and higher power logic devices as well as all common
types of memory devices. The FOX-XP and FOX-NP systems are full
wafer contact and singulated die/module test and burn-in systems
used for burn-in and functional test of complex devices, such as
leading-edge memories, digital signal processors, microprocessors,
microcontrollers, systems-on-a-chip, and integrated optical
devices. The FOX-CP system is a new low-cost single-wafer compact
test and reliability verification solution for logic, memory and
photonic devices and the newest addition to the FOX-P product
family. The WaferPak contactor contains a unique full wafer probe
card capable of testing wafers up to 300mm that enables IC
manufacturers to perform test and burn-in of full wafers on Aehr
Test FOX systems. The DiePak Carrier is a reusable, temporary
package that enables IC manufacturers to perform cost-effective
final test and burn-in of both bare die and modules. For more
information, please visit Aehr Test Systems’ website at
www.aehr.com.
Safe Harbor StatementThis press release
contains certain forward-looking statements within the meaning of
Section 27A of the Securities Act of 1933 and Section 21E of the
Securities Exchange Act of 1934. Forward-looking statements
generally relate to future events or Aehr’s future financial or
operating performance. In some cases, you can identify
forward-looking statements because they contain words such as
"may," "will," "should," "expects," "plans," "anticipates,” “going
to,” "could," "intends," "target," "projects," "contemplates,"
"believes," "estimates," "predicts," "potential," or "continue," or
the negative of these words or other similar terms or expressions
that concern Aehr’s expectations, strategy, priorities, plans, or
intentions. Forward-looking statements in this press release
include, but are not limited to, future requirements and orders of
Aehr’s new and existing customers; bookings forecasted for
proprietary WaferPakTM and DiePak consumables; and expectations
related to long-term demand for Aehr’s productions and the
attractiveness of key markets. The forward-looking statements
contained in this press release are also subject to other risks and
uncertainties, including those more fully described in Aehr’s Form
10-K for fiscal 2020, Form 10-Q for the first fiscal quarter of
fiscal 2021 and other reports filed from time to time with the
Securities and Exchange Commission. Aehr disclaims any obligation
to update information contained in any forward-looking statement to
reflect events or circumstances occurring after the date of this
press release.
Contacts: |
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Aehr Test
Systems
Vernon
Rogers
EVP of Sales & Marketing(510)
623-9400 x215vrogers@aehr.com |
|
MKR Investor Relations Inc.Todd Kehrli or Jim
ByersAnalyst/Investor Contact (323)
468-2300aehr@mkr-group.com |
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