Xperi Partners With UMC to Support Production of Direct and Hybrid Bonding 3D Semiconductor Technologies
August 02 2018 - 9:05AM
Business Wire
Partnership enables UMC to develop and
manufacture products utilizing Invensas DBI and ZiBond
technologies
Xperi Corporation (Nasdaq:XPER) (“Xperi”) is pleased to announce
a partnership with leading global semiconductor foundry, UMC. This
strategic partnership will enable the companies to support the
growing demand for Invensas ZiBond® and Invensas DBI® 3D
semiconductor technologies.
Together, Xperi and UMC will further optimize and commercialize
the ZiBond and DBI technologies for a wide range of semiconductor
devices including image sensors, radio frequency (RF), MEMS,
display drivers, touch controllers, SoC, analog, power and
mixed-signal devices. Wafer to wafer (W2W) and die to wafer (D2W)
bonding and 3D interconnect implementations will be employed to
address the requirements of a variety of applications within the
mobile, consumer, automotive, communication, industrial and
Internet of Things (IoT) industries.
“As a world-leading semiconductor foundry, we are committed to
delivering leading-edge solutions to our customers,” said Wenchi
Ting, vice president of specialty technologies at UMC. “By
partnering with Xperi and the Invensas team, true pioneers in
direct and hybrid bonding technologies, we continue to be
well-positioned to meet our customers’ evolving requirements for
advanced wafer bonding technologies.”
“We are excited to join forces with UMC, a premier global
foundry engaged in every major sector of the electronics industry,
to expand the production base for our ZiBond and DBI bonding and 3D
interconnect platforms,” said Craig Mitchell, president, Invensas.
“We look forward to working together to proliferate these enabling
technologies into a wide range of high volume semiconductor
applications.”
ZiBond is a low temperature homogenous direct bonding
technology that forms strong bonds between
semiconductor wafers or die with same or different
coefficients of thermal expansion. This technology is used in image
sensors, MEMS and various RF front-end devices.
DBI is a low temperature hybrid direct bonding technology
that allows semiconductor wafers or die to be bonded with
exceptionally fine pitch 3D electrical interconnect. This
technology is suited for various semiconductor devices such as
image sensors, DRAM, MEMS and RF devices.
Products employing these technologies are found in smartphones,
tablets, laptops, cameras, televisions and gaming consoles, as well
as in industrial, automotive and IoT electronic devices.
For more information about Xperi and its technologies platforms,
please visit www.xperi.com.
About Xperi Corporation
Xperi Corporation (Nasdaq: XPER) and its brands, DTS,
FotoNation, HD Radio, Invensas and Tessera, are dedicated to
creating innovative technology solutions that enable extraordinary
experiences for people around the world. Xperi’s solutions are
licensed by hundreds of leading global partners and have shipped in
billions of products in areas including premium
audio, automotive, broadcast, computational imaging, computer
vision, mobile computing and communications, memory, data
storage, and 3D semiconductor interconnect and
packaging. For more information, please call 408-321-6000 or
visit www.xperi.com.
About UMC
UMC (NYSE: UMC, TWSE: 2303) is a leading global semiconductor
foundry that provides advanced IC production for applications
spanning every major sector of the electronics industry. UMC’s
comprehensive foundry solutions enable chip designers to leverage
the company’s sophisticated technology and manufacturing, which
include world-class 28nm High-K/Metal Gate technology, 14nm FinFET
volume production, specialty process platforms specifically
developed for AI, 5G and IoT applications and the automotive
industry’s highest-rated AEC-Q100 Grade-0 manufacturing
capabilities for the production of ICs found in vehicles. UMC’s 11
wafer fabs are strategically located throughout Asia and are able
to produce over 600,000 wafers per month. The company employs more
than 20,000 people worldwide, with offices in Taiwan, China,
Europe, Japan, Korea, Singapore, and the United States. UMC can be
found on the web at http://www.umc.com.
Invensas, Xperi and their respective logos are trademarks or
registered trademarks of affiliated companies of Xperi Corporation
in the United States and other countries. All other company, brand
and product names may be trademarks or registered trademarks of
their respective companies.
SOURCE: XPERI CORPORATION
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