Toshiba Memory Corporation Unveils Embedded NAND Flash Memory Products for Automotive Applications Compliant with UFS Ver. 2.1
December 11 2017 - 11:13PM
Business Wire
- Addresses data storage demands of
increasingly complex applications including automotive information
& entertainment systems and ADAS -
Toshiba Memory Corporation, the world leader in memory
solutions, today announced that it has begun shipping samples of
embedded NAND flash memory products for automotive applications
that are compliant with JEDEC UFS[1] version 2.1[2]. The new
products meet AEC-Q100 Grade2[3] requirements and support a wide
temperature range of -40°C to +105°C, offering the enhanced
reliability capabilities that are required by increasingly complex
automotive applications. The line-up meets a broad range of
applications requirements with five different capacities: 16GB,
32GB, 64GB, 128GB and 256GB. [4]
This press release features multimedia. View
the full release here:
http://www.businesswire.com/news/home/20171211006358/en/
Toshiba Memory Corporation: Automotive
UFS products (Photo: Business Wire)
The new products are embedded NAND flash memory products that
integrate NAND chips fabricated with 15nm process technology and a
controller in a single package. Storage requirements for automotive
applications continue to increase as systems including automotive
information & entertainment systems and ADAS[5] become more
sophisticated, and UFS supports their high performance and density
needs. The addition of automotive UFS expands Toshiba Memory
Corporation’s line-up of embedded NAND flash memory products for
automotive applications, which currently includes automotive
e-MMC[6] products. Utilizing the UFS interface allows the new
products to achieve sequential read of 850MB/s and random read of
50kIOPs, which are approximately 2.7 times and 7.1 times faster
than their current e-MMC counterparts, respectively.[7]
Other new functions specifically suited to automotive
applications have been added to the new UFS products, including
Refresh, Thermal Control and Extended Diagnosis. Refresh can be
used to refresh data stored in the UFS and can contribute to the
extension of the data’s life span. Thermal Control protects against
overheating in the high temperatures that can occur in automotive
applications. Extended Diagnosis helps users to understand the
condition of the product.
Toshiba Memory Corporation’s UFS products have been used to
boost overall system performance in mobile devices, and the
introduction of automotive UFS products is expected to have a
similarly positive impact on the development of automotive
information & entertainment systems and ADAS. Toshiba Memory
Corporation is already in discussion with major automobile makers
on the possibility of implementing the new line-up in
next-generation projects. As the storage requirements for
automotive applications continue to grow, Toshiba Memory
Corporation will continue to lead the market by reinforcing its
lineup of high-performance, high-density memory solutions targeting
the sector.
Outline of the New
Products
Interface JEDEC UFS V2.1 standard
HS-G3 interface
Capacity 16GB, 32GB, 64GB, 128GB, 256GB Power Supply Voltage
2.7-3.6V (Memory core)1.7V-1.95V
(Interface)
Temperature Range -40oC to +105oC Product Name
Capacity Package Sample Date THGAF9G7L1LBAB7 16GB
153Ball FBGA 11.5x13.0x1.0mm Dec. 2017 THGAF9G8L2LBAB7 32GB
153Ball FBGA 11.5x13.0x1.0mm Dec. 2017 THGAF9G9L4LBAB8 64GB 153Ball
FBGA 11.5x13.0x1.2mm Dec. 2017 THGAF9T0L8LBAB8 128GB 153Ball FBGA
11.5x13.0x1.2mm Dec. 2017 THGAF9T1LBLBABY 256GB
169Ball FBGA 12.0x16.0x1.6mm 2Q, 2018 (Apr. - Jun.)
Key Features1. Extended Temperature RangeSupports
operating temperature range of -40°C to +105°C.Reliability tests
were conducted to meet AEC-Q100 Grade2 specifications, in addition
to JEDEC compliance tests.2. Wide Capacity RangeSupports a wide
range of capacities, from 16GB to 256GB, to suit a variety of
automotive applications, including automotive information &
entertainment systems and ADAS, which typically needs high capacity
storage, plus other applications, such as wireless communication,
which may need only a small capacity.3. High PerformanceBy
utilizing the UFS interface, the new products achieve a sequential
read of 850MB/s and random read of 50kIOPs, which are approximately
2.7 times and 7.1 times faster than their current e-MMC
counterparts, respectively. [7]4. Additional Functions Suited for
Automotive ApplicationsSupports additional functions suited for
automotive applications includes Refresh, Thermal Control and
Extended Diagnosis.
*Company names, product names, and service names mentioned
herein may be trademarks of their respective companies.
Notes[1] Universal Flash Storage (UFS) is the product category
for the class of embedded memory products built to the JEDEC UFS
standard specification.[2] One of standard specifications of
embedded NAND flash memory defined by JEDEC.[3] Electrical
component qualification requirements defined by the AEC (Automotive
Electronics Council).[4] Product density is identified based on the
density of memory chip(s) within the Product, not the amount of
memory capacity available for data storage by the end user.
Consumer-usable capacity will be less due to overhead data areas,
formatting, bad blocks, and other constraints, and may also vary
with the host device and application. 1GB is calculated as
1,073,741,824 bytes. For details, please refer to applicable
product specifications.[5] Advanced Driving Assistant System[6]
e-MMC is a product category for a class of embedded memory products
built to the JEDEC e-MMC Standard specification.[7] Comparison of
Toshiba Memory Corporation’s 64GB devices.
Customer Inquiries:Memory Marketing DivisionTel:
+81-3-3457-3451http://toshiba.semicon-storage.com/ap-en/contact.html
Information in this document, including product prices and
specifications, content of services and contact information, is
current on the date of the announcement but is subject to change
without prior notice.
View source
version on businesswire.com: http://www.businesswire.com/news/home/20171211006358/en/
Media Inquiries:Toshiba Memory CorporationKoji Takahata,
+81-3-3457-3822Sales Strategic Planning
Divisionsemicon-NR-mailbox@ml.toshiba.co.jp