QSFP-DD MSA Group Announces New Hardware Specification
September 19 2017 - 2:07AM
Business Wire
Quad Small Form Factor Pluggable Double Density MSA releases 3.0
Hardware Specification
The Quad Small Form Factor Pluggable Double Density (QSFP-DD)
Multi Source Agreement (MSA) group has released an updated 3.0
Hardware specification for the new QSFP-DD form factor. In total,
62 companies came together in support of the QSFP-DD MSA to address
the industry need for a high-density, high-speed networking
solution.
Established in March 2016, the QSFP-DD MSA group accepted the
challenge to meet the market demand for a next generation
high-density, high-speed pluggable backwards compatible module form
factor. The MSA group has succeeded in releasing a 3.0 Hardware
specification with broad market support that overcomes the
technical challenges of specifying a QSFP28 compatible
double-density interface. The QSFP-DD specification defines
mechanical, electrical, and thermal management requirements to
enable multi-vendor interoperability.
QSFP-DD pluggable modules can support quadruple the bandwidth of
conventional QSFP modules, allowing networking equipment to keep
pace with advances in ASIC technology. Systems designed for QSFP-DD
modules will be backwards compatible with existing QSFP form
factors and provide increased flexibility for end users, network
platform designers and integrators.
The QSFP-DD 3.0 Hardware specification defines a module and both
a stacked height integrated cage/connector system and a single
height cage/connector system. The MSA has redefined the scope on
the QSFP form factor, the industry’s leading multi-lane pluggable
form factor used across Ethernet, Fibre Channel and InfiniBand.
QSFP was initially launched at 40 Gbps and 100 Gbps network
applications and now QSFP-DD supports up to 400 Gbps in aggregate
over an 8 x 50 Gbps electrical interface.
QSFP-DD MSA founder-promoters include Broadcom, Brocade, Cisco,
Corning, Finisar, Foxconn Interconnect Technology, Huawei, Intel,
Juniper Networks, Lumentum, Luxtera, Mellanox Technologies, Molex,
Oclaro, and TE Connectivity.
Contributors include Acacia, ACON, Alibaba, Amphenol, Applied
Optoelectronics, APRESIA Systems, Cavium, Celestica, Ciena,
ColorChip, Dell EMC, Delta Products, Fujitsu Optical Components,
Genesis, H3C, Hisense Broadband, Hitachi Metals, Hewlett Packard
Enterprise, Innovium, Inphi, Ixia, JPC, Kaiam, LEONI, Lorom,
Luxshare-ICT, MACOM, MaxLinear, MultiLane, NeoPhotonics, Nokia,
Panduit, PHY-SI, Ranovus, Samtec, SENKO, Semtech, Sicoya, Siemon,
Skorpios Technologies, Source Photonics, Spectra7 Microsystems,
Spirent, Sumitomo Electric, US Conec, Xilinx, and Yamaichi
Electronics.
The QSFP-DD form factor specification is available for free
download at the QSFP-DD MSA website www.qsfp-dd.com.
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identified by the fact that they do not relate strictly to
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Outlook Marketing ServicesChrista CarrollSenior Vice
President630.408.9164Christa@outlookmarketingsrv.com