PITTSBURGH, Pa., Jan. 30, 2018 /PRNewswire/ -- The next generation
of ANSYS (NASDAQ: ANSS) industry-leading engineering simulation
simplifies workflows and ensures accurate results, enabling users
to deliver revolutionary products while reducing costs and time to
market. ANSYS® 19 empowers engineers to develop groundbreaking
products, from autonomous vehicles to smarter devices to more
electric aircraft, at an unprecedented pace.
Products are becoming more complicated as the digital and
physical worlds continue to merge. Companies are faced with
unrelenting pressure to drive innovation and increase product
quality while reducing cycle times, costs and risk. ANSYS 19 helps
engineers manage complexity and enhance productivity, empowering
users to provide even more accurate answers across the broadest
range of applications – making simulation even more pervasive.
"With the digital revolution accelerating the pace of disruption
and product innovation, engineers must overcome extraordinarily
sophisticated design and engineering challenges to deliver
breakthrough products faster than ever," said Eric Bantegnie, vice
president and general manager, systems business unit, ANSYS. "With
ANSYS 19, engineers can use simulation pervasively to tame
complexity and spur innovation at every level, resulting in the
next generation of smarter, more cutting-edge products."
Highlights of the release include:
Taming Complexity. ANSYS 19 tames complexity by
supporting and empowering engineers with tools that improve
reliability, performance, speed and ease of use.
From support for Architecture Analysis and Design Language
(AADL) to Human Machine Interfaces (HMIs) to radar cross section
(RCS) calculations, ANSYS 19 simplifies user experience across
every discipline.
In the embedded suite, ANSYS 19 includes new support for
AADL-compatible avionics systems modeling. AADL-based
modeling empowers organizations to understand and control their
system costs, but also maximizes critical performance
characteristics such as system reliability, integration, security
and availability. By modeling systems in AADL, companies can more
effectively integrate subsystems and components that have been
procured from many subcontractors – enabling users to more quickly
identify and address interoperability issues. Capable of modeling
software and hardware components, ANSYS 19 provides the broadest
and most proven toolset to support the design of avionics systems
for military applications that are compliant and conform to the
FACE technical standard.
Advancements in autonomous technology across industries demand
increased functionality and testing within applications. With ANSYS
19, engineers can design and implement complex and state-of-the-art
embedded HMIs. From designing cockpit displays for aircraft to
infotainment and dashboard displays for automobiles, to control
room displays for industrial applications, ANSYS 19 accelerates the
development, deployment and testing of safety-critical HMIs.
In the electromagnetics suite, ANSYS introduces RCS analysis
using HFSS SBR+. This technology is ideal for engineers designing
autonomous vehicles, advanced detection systems and stealth
technology, these capabilities enable users to digitally explore
and optimize more design iterations in less time.
"At AirLoom Energy, our goal of revolutionizing wind
energy capture depended on an impossible task: developing a
transverse flux permanent magnet linear generator. After two
leading experts in machine design told us that an intrinsically 3-D
machine requiring finite element analysis would be impossible to
implement practically, ANSYS provided the solution we needed,"
Robert Lumley, founder, AirLoom
Energy. "With ANSYS tools, we characterized dozens of
topologies and tens of thousands of geometries, optimizing our
generator and achieving patent success."
Predicting the impact of temperature in electronics products has
become paramount to delivering reliable, high-performance,
electronics. Thermal impact on the design is a key driver for
material selection, cooling strategy and form factor decisions that
ultimately determine the size, weight and cost of the final
product. ANSYS 19 delivers a robust, integrated
electromagnetic-thermal workflow that predicts crucial thermal
effects within electronics designs.
"To design the highest performance connectors, interconnect
systems, packages, optical engines and cables, Samtec requires
design software that is accurate, predictable and fast," said
Scott McMorrow, chief technology
officer, Signal Integrity Group, Samtec, Inc. "The work ANSYS is
doing to create a seamless integrated electro-thermal design flow
combined with 3-D component technology delivers capability that
will help us continue to revolutionize the electronic connector
industry."
New to the systems suite, ANSYS® mediniTM analyze is now
available for functional safety analysis in applications for
automotive, aerospace and defense, rail, nuclear and other
safety-critical industries. By implementing step-by-step modeling,
analysis and verification processes that conform to applicable
safety standards, this update simplifies and automates the analysis
of failure modes and their coverage by safety mechanisms under a
wide range of operating scenarios.
Next-generation automotive, mobile and high-performance
computing applications require advanced systems on chips that are
bigger, faster and more complex. ANSYS 19 for semiconductors
provides comprehensive simulation solutions that simultaneously
solve for various design attributes such as power noise, thermal
properties, reliability and performance across the spectrum of
chip, package and system. The big data simulation platform in ANSYS
19 enables rapid design iterations across multiple operating
conditions and its actionable analytics can be used to prioritize
design fixes to accelerate time to market.
Spurring Productivity: ANSYS 19 delivers solutions that
greatly enhance productivity and create a more seamless workflow at
every stage — empowering engineers to accomplish more in shorter
timelines. From improvements at the solver and technology level
that result in even faster, more powerful product performance to
updates that ease time-to-certification, ANSYS 19 improves time to
market and engineers' productivity.
In the fluids suite, ANSYS 19 empowers engineers to produce
better results in less time and with less effort. New
functionalities significantly reduce the computational effort
needed for spray nozzle designers to optimize product performance.
ANSYS 19 uses the volume of fluid model to directly track interface
instabilities and surface tension effects that give rise to
ligament and droplet formation — resulting in fast, accurate spray
breakup and droplet distribution with minimal effort. While it was
previously computationally impractical to calculate droplet size
distribution using conventional methods, the new functionality
reduces the computational effort significantly.
In the structures suite, breakthrough updates to the ANSYS
separating, morphing, adaptive and re-meshing technology fracture
method enhance speeds and automate the remeshing approach. The
industry-first material force fracture parameter enables the user
to go beyond the traditional linear elastic fracture mechanics
assumptions. Advances to the non-linear adaptivity capability in
ANSYS 19 empower engineers to conquer non-linear problems in
applications like sealing and forming materials.
"Ansys simulation software has been the key enabling tool to
allow us to design highly integrated RF structures for 3-D printing
that are 10x smaller and 90 percent lighter than traditional
fabrication processes allow," said Michael
Hollenbeck, chief technology officer, OPTISYS. "Ansys
simulation software's powerful optimization capabilities have
allowed us to shorten our design cycles by 30 to 50 percent, and
effectively move all prototyping from hardware into
simulation."
In the mechanical and electromagnetic suites, ANSYS 19 increases
the number of built-in high-performance computing (HPC) cores from
two to four. Combined with faster and more scalable solvers, the
additional HPC cores deliver significant computational power and
result in additional capacity. To increase flexibility, customers
can also use the same ANSYS HPC license to enable all ANSYS
products. These changes make licensing more consistent and easier
for customers to deploy across their organizations.
"ANSYS' open-cloud approach is perfectly aligned with our hybrid
HPC strategy," said Bill Mannel,
vice president and general manager of HPC and AI, Hewlett Packard
Enterprise (HPE). "Powered by HPE's high-performance computing
solutions, ANSYS 19 enables the enterprise to run more jobs, faster
— allowing engineers to spend less time prototyping and more time
focusing on customer needs."
As aerospace and automotive vehicles become more autonomous, the
applications used in these industries become more complex,
requiring multirate capabilities. Multirate applications are common
in embedded software but come with challenges that must be
performed manually, including data handling between functions at
different rates and scheduling these functions for execution. With
ANSYS 19, the multirate application support in the embedded suite
provides a seamless flow to capture and verify multirate
application architecture in an application code that is portable,
qualifiable and certified — enabling faster times to certification
and qualification.
In the 3-D design suite, ANSYS 19 empowers engineers at every
level to explore new design spaces with simulation, regardless of
their experience level. With ANSYS 19, engineers can produce
lighter-weight, stronger designs in a shorter amount of time
through enhancements in topology optimization. ANSYS now provides
shape optimization updates while solving — providing engineers
additional control over the final design in a shorter amount of
time. Printing enhancements also enable users to more quickly
smooth, repair and optimize topology optimized shapes for
downstream use.
"Reducing vehicle fuel consumption and emissions are top
priorities for the automotive industry, and reducing vehicle weight
is one of the most effective ways to achieve those goals," said
Sachin Hardikar, computer aided
engineering engineer at KSR International. "KSR International
engineers used the ANSYS topology optimization solution to largely
automate the process of redesigning a brake pedal to reduce its
weight. Using ANSYS, we reduced structural optimization time from
seven to two days, while achieving a 21 percent weight savings,
which is considerably more than could have been accomplished using
conventional methods. ANSYS 19 will help us continue to achieve
substantial weight savings without having to invest significant
engineering resources."
For more information about the features and enhancements
available in ANSYS 19, visit ANSYS.com/19.
About ANSYS,
Inc.
If you've ever seen a rocket launch, flown on an airplane,
driven a car, used a computer, touched a mobile device, crossed a
bridge, or put on wearable technology, chances are you've used a
product where ANSYS software played a critical role in its
creation. ANSYS is the global leader in Pervasive Engineering
Simulation. We help the world's most innovative companies deliver
radically better products to their customers. By offering the best
and broadest portfolio of engineering simulation software, we help
them solve the most complex design challenges and create products
limited only by imagination. Founded in 1970, ANSYS employs
thousands of professionals, many of whom are expert M.S. and
Ph.D.-level engineers in finite element analysis, computational
fluid dynamics, electronics, semiconductors, embedded software and
design optimization. Headquartered south of Pittsburgh, Pennsylvania, U.S.A., ANSYS has
more than 75 strategic sales locations throughout the world with a
network of channel partners in 40+ countries. Visit www.ansys.com
for more information.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
ANSS-C
CONTACT:
Cecilia
Hellman
+46-735-18-59-50
cecilia.hellman@ansys.com
Mary Kate Joyce
+1-724-820-4368
marykate.joyce@ansys.com
INVESTOR RELATIONS
Annette
Arribas, CTP
+1-724-820-3700
annette.arribas@ansys.com
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PDF
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http://mb.cision.com/Public/16205/2440742/ba717c1aaab2dd49.mp4
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