Semiconductor Market Updates: Networking Equipment Market Slows in
Second Half of 2012, Intel Dominates Mid-End Wafers, 3DIC Material
Market to Reach $2B in 2017
FARMINGTON, Conn., Nov. 19, 2012 /PRNewswire-iReach/ -- In the
networking IC market, growth continues to be driven by
infrastructure markets supporting the growing volume of data and
users on the Internet. Meanwhile, according to new research from
Yole Developpement, the equipment and materials business will
quadruple over the next five years in the 3D TSV, FO WLP, 3D WLP,
WLCSP, 2.5D interposers and flip-chip wafer segments.
(Photo: http://photos.prnewswire.com/prnh/20121119/CG16190)
Global Information Inc (GII) highlights new market research from
our premium partner publishers that will benefit executives
involved in the global market for semiconductor materials and
manufacturing.
2012 Networking Market Tracker
The overall networking equipment market has slowed in the second
half of 2012 with many customers decelerating and reducing spending
on hardware. Most of the large equipment OEMs are predicting that
fourth quarter revenues will remain flat sequentially from the
third quarter, due to exposure to Europe where service providers have cut
spending and increasing competition from lower cost domestic
equipment makers in China.
The networking IC market consists of products that are used in
network equipment including network switches, routers, modems,
adapters, cards, line cards, cable infrastructure, DSLAM, and other
central office equipment. This market is driven by continued high
growth in the infrastructure markets supporting the growing volume
of data and users on the Internet.
Capital expenditures for data centers are expected to be up
double digits this year, so next year there could be a slowdown.
However, this market continues to advance at a pace not seen in
other traditional segments. Some OEM customers that serve this
market include Cisco Systems, F5 Networks, Juniper Networks,
Hewlett Packard, and Huawei. Cisco has the lions share, but the
other network equipment providers are steadily gaining momentum in
the market.
An Executive Summary for this report and free sample pages from
the full document are available at
http://www.giiresearch.com/report/data237351-2012-networking-market-tracker.html
Equipment & Materials for 3DIC &
Wafer-Level-Packaging
The global material market is expected to grow from
approximately $590 million this year to over $2 billion by 2017 at
a compound annual growth rate of 24%. Growth in the global market
for 3DIC and wafer-level-packaging will be driven mainly by the
expansion of 2,5D interposers and 3D TSV& WLP platforms.
However, Yole Developpement forecasts a a slight decrease in
2012 due to the fact that high-volume production in 3D TSV, FO WLP,
and 3D WLP has not yet begun.
This report includes an Excel database with detailed activity of
over 375 small, medium and large equipment and material suppliers
ranging from front-end, back-end assembly, PCB, LCD, and solar
divisions.
An Executive Summary for this report and free sample pages from
the full document are available at
http://www.giiresearch.com/report/yd194054-equipment-materials-3dic-wafer-level-packaging.html
Wafer Packaging Fabs Database 2012
Stay informed on global wafer-scale packaging activity of 275
middle-end factories with this new database from Yole
Developpement. This unique tool provides a global overview of
"who is doing what" in this emerging ecosystem. The database
provide details concerning each fab location by fab function,
customers, JV, capacities by wafer size, and more.
Major companies cited in the database include: Amkor, Analog
Devices, ASE, ASTRI, Avago, Bosch, BEA-LETI, China WLCSP, ChipBond,
ChipMOS. EPCOS-TDK, Epson Electronics, Fairchild, Flip Chip
international, Flip Chip Millennium, Fraunhofer, Freescale,
Fujikura, Fujitsu Integrated Microtechnology, Global
Foundries, IBM, IMEC, Infineon, INTEL, ITRI, JCET, Maxim IC,
NANIUM, NEPES, NXP, OptoPAC, PTI, Renesas, Rohm, Samsung, SMIC, SK
Hynix, Sony, SPIL, STATS ChipPAC, STMicroelectronics, Teramikros,
Texas Instrument, Tezzaron, Toshiba, TriQuint, TSMC, UMC Global,
and Xintec.
An Executive Summary for this report and free sample pages from
the full document are available at
http://www.giiresearch.com/report/yd206538-wafer-packaging-fab-database.html
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