SAN JOSE, Calif., Oct. 22, 2012 /PRNewswire/ -- Ultratech, Inc.
(Nasdaq: UTEK), a leading supplier of lithography and
laser-processing systems used to manufacture semiconductor devices
and high-brightness LEDs (HB-LEDs), today announced a new laser
spike anneal (LSA) product family―LSA201, LSA201LP, and
LSA201HP―built on a new platform that provides full-wafer ambient
control processing for sub-20nm nodes. The LSA201's simple
and robust design includes Ultratech's patented micro-chamber
design for achieving ambient control in a scanning system.
Currently, the system can run mixtures of any inert gases, but the
general micro-chamber architecture is extendible to more exotic
gases for future processes. Ultratech plans to begin shipping
LSA201 systems in the first half of 2013, and already has customer
commitments with the first shipment scheduled in Q1,
2013.
Traditional junction activation processes do not require ambient
control. However, as devices scale below 20nm, Ultratech
expects adoption of additional processes involving interface
engineering and film property modification. Full-wafer
ambient control is expected to become a critical capability for
some of these types of processes. In Ultratech's unique
design, a micro-chamber is formed around the wafer by bringing a
stationary water-cooled plate close to the top of the wafer, and
implementing a non-contact gas bearing around the perimeter of the
wafer to make a seal with this plate. The micro-chamber is at
atmospheric pressure, and does not require the complicated hardware
associated with vacuum systems.
Like the LSA101 platform, there are also two dual-beam products
based on the LSA201 platform: the LSA201LP, which features a second
low-power beam for extension to low-temperature processing, and the
LSA201HP, which features a second high-power beam for extension to
longer dwell times. The LSA201LP targets middle-of-line (MOL)
applications, such as nickel silicide formation, and the LSA201HP
targets advanced front-end-of-line (FEOL) applications, such as
defect annealing. A standard LSA201 system can be field
upgraded to a LSA201LP or LSA201HP, enabling customers to extend
their tool capabilities without switching to a new platform.
Jeff Hebb, Ph.D., Vice President
of Laser Product Marketing at Ultratech said, "As our customers
move to smaller nodes, we expect that they will demand a
fully-controllable ambient system for some of their non-junction
processes. With this new platform, Ultratech continues to
stay aligned with its customers' advanced technology roadmaps, and
enables them to expand laser annealing to new processes with new
materials. Furthermore, our dual-beam products available on
the LSA201 platform allow our customers to have ambient control
over the whole range of application space offered on the LSA101
platform. We also think our customers will appreciate the
simplicity of the design for high-volume manufacturing."
LSA201 Laser Spike Anneal System
Ultratech's LSA201 LSA system built on the highly customizable
Unity Platform™ includes a patented micro chamber for full-wafer,
ambient control for processing at 14nm and below nodes. The
micro chamber uses a nitrogen bearing for a non-contact solution
and mass flow controllers (MFCs), which enable the use of other
exotic gases. The LSA201 platform is field upgradable with all of
Ultratech's dual-beam configurations for applications that require
a low chuck temperature. The LSA201 is well suited for
processes such as interface engineering and film property
modification where ambient control is critical at 14nm and
below. In addition, Ultratech's LSA201 can potentially be
used for nickel silicide, high-k/metal gate, and high-k annealing
processes.
Certain of the statements contained herein, which are not
historical facts and which can generally be identified by words
such as "anticipates," "expects," "thinks," "intends," "will,"
"could," "believes," "poised," "estimates," "continues," and
similar expressions, are forward-looking statements under Section
27A of the Securities Act of 1933, as amended, and Section 21E of
the Securities Exchange Act of 1934, as amended, that involve risks
and uncertainties, such as risks related to timing, delays,
deferrals and cancellations of orders by customers, including as a
result of semiconductor manufacturing capacity as well as our
customers' financial condition and demand for semiconductors;
demand for consumer devices; industry growth within the company's
served markets; continued delivery of financial performance and
value; cyclicality in the semiconductor and nanotechnology
industries; our dependence on new product introductions and market
acceptance of new products and enhanced versions of our existing
products; lengthy sales cycles, including the timing of system
installations and acceptances; lengthy and costly development
cycles for laser-processing and lithography technologies and
applications; integration, development and associated expenses of
the laser processing operation; general economic and financial
market conditions including impact on capital spending, as well as
difficulty in predicting changes in such conditions; rapid
technological change and the importance of timely product
introductions; customer concentration; pricing pressures and
product discounts; high degree of industry competition;
intellectual property matters; changes in pricing by us, our
competitors or suppliers; international sales and operations;
timing of new product announcements and releases by us or our
competitors; ability to volume produce systems and meet customer
requirements; sole or limited sources of supply; effect of capital
market fluctuations on our investment portfolio; ability and
resulting costs to attract or retain key personnel; dilutive effect
of employee stock option grants on net income per share, which is
largely dependent upon our achieving and maintaining profitability
and the market price of our stock; mix of products sold; outcome of
litigation; manufacturing variances and production levels; timing
and degree of success of technologies licensed to outside parties;
product concentration and lack of product revenue diversification;
inventory obsolescence; asset impairment; changes to financial
accounting standards; effects of certain anti-takeover provisions;
future acquisitions; volatility of stock price; foreign government
regulations and restrictions; business interruptions due to natural
disasters or utility failures; environmental regulations; and any
adverse effects of terrorist attacks in the United
States or elsewhere, or government responses thereto, or
military actions in Iraq, Afghanistan and elsewhere, on
the economy, in general, or on our business in particular. Such
risks and uncertainties are described in
Ultratech's SEC reports including its Annual Report on
Form 10-K filed for the year ended December 31, 2011 and
our quarterly report on Form 10-Q for the quarter ended June
30, 2012. Due to these and additional factors, the statements,
historical results and percentage relationships set forth herein
are not necessarily indicative of the results of operations for any
future period. These forward-looking statements are based on
management's current beliefs and expectations, some or all of which
may prove to be inaccurate, and which may change. We undertake no
obligation to revise or update any forward-looking statements to
reflect any event or circumstance that may arise after the date of
this release.
About Ultratech: Ultratech, Inc. (Nasdaq: UTEK) designs,
manufactures and markets photolithography and laser processing
equipment. Founded in 1979, the company's market-leading
advanced lithography products deliver high throughput and
production yields at a low, overall cost of ownership for bump
packaging of integrated circuits and high-brightness LEDs
(HB-LEDs). A pioneer of laser processing, Ultratech developed
laser spike anneal technology, which increases device yield,
improves transistor performance and enables the progression of
Moore's Law for 32-nm and below production of state-of-the-art
consumer electronics. Visit Ultratech online at:
www.ultratech.com.
(UTEK-G)
Unity Platform is a trademark of Ultratech, Inc.
SOURCE Ultratech, Inc.