DSP Group Unveils SparkPA, Highest RF Transmit Power CMOS Power Amplifier (PA) for 802.11ac Access Points Using TSMC Standard...
January 05 2016 - 7:00AM
DSP Group®, Inc. (NASDAQ:DSPG), announced the launch of
SparkPA – a revolutionary RF Power Amplifier (PA)
for the high performance and technically challenging 802.11ac
Access Point market, using a standard CMOS Process from TSMC (TWSE:
2330, NYSE: TSM).
Leveraging a decade of DSP Group’s core
expertise in RF and CMOS PA technology, SparkPA
achieves more than 100mW of output power at -35db EVM and more than
50 mW at -40db EVM with excellent stability over temperature. When
incorporated into access points, SparkPA has been
proven to dramatically improve device performance.
SparkPA is now available on DSP
Group’s DFE552 Platform. This offering challenges the traditional
approach to PA manufacturing, with outstanding RF performance from
a standard CMOS process, so opening a window to a $6-10 billion
market. SparkPA is well positioned to support the
new Wave 2 and Wave 3 802.11ac Access Point requirements, including
160 MHz channel, MU-MIMO at 4x4 and 8x8 topologies as well as
future 1024 QAM, leveraging its superior linearity performance.
Moreover, the CMOS PA allows frequency and linearity
configurability per packet.
"Our work with TSMC has produced the most
advanced and high performance CMOS solution for 802.11ac segment,"
said Ofer Elyakim, CEO of DSP Group. "The 802.11ac power amplifier
requirements are considered to be among the most challenging in the
RF frontend segment. Our innovative approach allows us to
demonstrate groundbreaking EVM noise performance that can deliver
the most advanced features required by customers in a cost
effective manner. We will continue to innovate and leverage our
core expertise in new domains,” he concluded.
“Our more than a decade-long technology
collaboration with DSP Group continues to produce innovative
results,” said Maria Marced, President, TSMC Europe. “The arrival
of the SparkPA is in tune with market demand for cost-effective
CMOS PA applications. With the outstanding performance of SparkPA,
DSP Group has achieved new levels of product integration and
innovation, providing designers with a PA that achieves the
performance, power and area goals for their RF designs. TSMC looks
forward to continuing our collaboration with DSP Group," she
continued.
About DSP GroupDSP Group®, Inc.
(NASDAQ:DSPG) is a leading global provider of wireless chipset
solutions for converged communications. Delivering semiconductor
system solutions with software and hardware reference designs, DSP
Group enables OEMs/ODMs, consumer electronics (CE) manufacturers
and service providers to cost-effectively develop new
revenue-generating products with fast time to market. At the
forefront of semiconductor innovation and operational excellence
for over two decades, DSP Group provides a broad portfolio of
wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN,
HDClear™, video and VoIP technologies. DSP Group enables converged
voice, audio, video and data connectivity across diverse mobile,
consumer and enterprise products – from mobile devices, connected
multimedia screens, and home automation & security to cordless
phones, VoIP systems, and home gateways. Leveraging
industry-leading experience and expertise, DSP Group partners with
CE manufacturers and service providers to shape the future of
converged communications at home, office, and on the go. For more
information, visit www.dspg.com.
Contact
Tali Chen, CVP Corporate Development,+1(408) 240-6826,
tali.chen@dspg.com
Taiwan Semiconductor Man... (NYSE:TSM)
Historical Stock Chart
From Mar 2024 to Apr 2024
Taiwan Semiconductor Man... (NYSE:TSM)
Historical Stock Chart
From Apr 2023 to Apr 2024