Dow MICROFILL™ Platform is a Four-Time Winner for Best New Product by Printed Circuit Design and Fab Magazine
March 16 2015 - 11:42AM
Business Wire
Enhancing Signal Transmission in a Connected World
For the fourth time, Dow Electronic Materials, a business unit
of The Dow Chemical Company (NYSE:DOW), has received a New Product
Introduction (NPI) Award from Printed Circuit Design and Fab
(PCD&F) Magazine for its MICROFILL™ platform, this time with
MICROFILL™ LVF 4 Acid Copper. As the Internet of Things advances,
speedy and stable signal transmission across wireless networks is
critical. Dow MICROFILL LVF 4 Acid Copper offers excellent microvia
filling and panel plating uniformity for circuit boards to enhance
signal transmission between smart devices.
Dow MICROFILL Solutions Enhances Signal
Transmission in a Connected World (Photo: Business Wire)
Dow MICROFILL solutions have won four NPI Awards from PCD&F,
including EVF Solution for microvia fill, THF Solution for
through-hole fill, and LVF 3 and LVF 4 Solutions for blind via fill
in High-Density-Interconnect circuit boards and IC substrates since
2009. “The developments in plating achieved by Dow Electronic
Materials with its MICROFILL line are nothing short of remarkable,”
said Mike Buetow, editor-in-chief of PCD&F. “We are thrilled to
recognize Dow for its continued achievement.” The NPI Award, in its
eighth year, recognizes the leading new products from the previous
year. Awards are selected by an independent panel of industry
engineers.
"Earning four NPI awards for our MICROFILL platform of products
demonstrates our strengths not only in developing industry-leading
solutions, but also in supporting emerging opportunities such as
the needs associated with Internet of Things," said JR Chen, global
business director for Dow Electronic Materials. “Our commitment and
passion to meeting customers’ needs is where our strengths are
from. We will continue to innovate with customers to enable a
connected world for tomorrow."
Dow Electronic Materials will showcase MICROFILL LVF 4 Acid
Copper and other innovations in CPCA show on March 17-19 and CTEX,
JPCA, Productronica, TPCA, and HKPCA shows in 2015.
About Dow Electronic Materials
Dow Electronic Materials, a global supplier of materials and
technologies to the electronics industry, brings innovative
leadership to the semiconductor, interconnect, finishing,
photovoltaic, display, LED and optics markets. From advanced
technology centers worldwide, teams of talented Dow research
scientists and application experts work closely with customers,
providing solutions, products and technical service necessary for
next-generation electronics. These partnerships energize Dow's
power to invent. Its key end-use applications include a broad range
of consumer electronics from personal computers, to television
monitors, smart phones and tablets and other mobile devices as well
as electronic devices and systems used in a variety of industries.
More information about Dow Electronic Materials can be found at
www.dowelectronicmaterials.com.
About Dow
Dow (NYSE: DOW) combines the power of science and technology to
passionately innovate what is essential to human progress. The
Company is driving innovations that extract value from the
intersection of chemical, physical and biological sciences to help
address many of the world's most challenging problems such as the
need for clean water, clean energy generation and conservation, and
increasing agricultural productivity. Dow's integrated,
market-driven, industry-leading portfolio of specialty chemical,
advanced materials, agrosciences and plastics businesses delivers a
broad range of technology-based products and solutions to customers
in approximately 180 countries and in high-growth sectors such as
packaging, electronics, water, coatings and agriculture. In 2014,
Dow had annual sales of more than $58 billion and employed
approximately 53,000 people worldwide. The Company's more than
6,000 products are manufactured at 201 sites in 35 countries across
the globe. References to "Dow" or the "Company" mean The Dow
Chemical Company and its consolidated subsidiaries unless otherwise
expressly noted. More information about Dow can be found at
www.dow.com.
®TM Trademark of The Dow Chemical Company (“Dow”) or an
affiliated company of Dow
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Dow Electronic MaterialsElysia Hsieh, +
886-37-539158ElysiaHsieh@dow.com
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