SAN JOSE, Calif., April 28, 2016 /PRNewswire/ -- Advanced
Semiconductor Engineering, Inc. (TAIEX: 2311) (NYSE: ASX) and Deca
Technologies, a subsidiary of Cypress Semiconductor Corp. (NASDAQ:
CY), today announced the signing of an agreement whereby ASE will
invest $60 million in Deca and will
license Deca's M-Series™ Fan-out Wafer-Level Packaging (FOWLP)
technologies and processes. As part of the agreement, ASE and Deca
will jointly develop the M-Series fan-out manufacturing process and
will expand production of chip-scale packages using this
technology. The technology is required for the reduced size and
power consumption needed for portable Internet of Things (IoT)
applications and smartphones. Deca's version of it uses autoline
technology developed by SunPower to decrease cost and manufacturing
cycle time.
"At Cypress we have experienced the efficiency of Deca's
M-Series technology with our own chips and brought its benefits to
our customers," said T.J. Rodgers,
Chairman of the Board at Deca Technologies and president and CEO of
Cypress Semiconductor Corp. "With this investment from ASE, Deca
now has strong validation of M-Series as a technology that will
bring fan-out wafer-level packaging to mass production. This deal
is a significant proof point for Deca and for Cypress's ongoing
strategy of investing in startups as part of our Emerging
Technologies Division."
The ability to put more functionality on ever-shrinking
semiconductors, also known as Moore's Law, is causing an unintended
consequence in the semiconductor packaging industry, where chips
using advanced silicon technologies are so small that all of the
input and output balls cannot fit on the surface of the chip using
conventional wafer-level chip-scale packaging (WLCSP) technology.
Deca's M-Series addresses this challenge with a FOWLP approach,
where very small silicon chips are embedded into a larger plastic
chip, and the CSP balls are redistributed onto both the native
silicon chip and the expanded plastic chip. M-Series enables
industry-leading manufacturability for FOWLP using Deca's
proprietary Adaptive Patterning™ technology, which tracks the
alignment of each silicon IC in the redistributed plastic package.
ASE has found M-Series to be a viable and effective high-volume
manufacturing FOWLP solution.
"With the increasing demands to improve performance and reduce
package size from the smartphone market and the emerging demand for
IoT, the industry has been looking for a FOWLP technology with true
manufacturability," said Chris Seams, CEO of Deca Technologies.
"Deca is excited to have ASE select our patented M-Series
technology to meet this challenge. By leveraging ASE's large
customer base and world-class manufacturing expertise, we can bring
FOWLP processing to high-volume reality."
Deca's fan-out wafer level packaging technologies will add to
ASE's advanced packaging portfolio, providing customers with a more
diverse selection of offerings that are best suited for their IC
designs. "Today's announcement is a major milestone in ASE's FOWLP
roadmap and demonstrates ASE's continued pursuit in industry
leadership to build a complete manufacturing eco-system with key
partners," said Dr. Tien Wu, COO,
ASE Group. "The incorporating of
Deca's M-Series and Adaptive Patterning technologies and
manufacturing process will enable ASE to offer customers a proven
FOWLP solution that is cost-effective due to the efficiency of
large-panel-based processing."
The proposed investment by ASE is subject to the various
regulatory approvals or consents including but not limited to the
approvals of the Taiwan
government.
About ASE Group
The ASE Group is the world's largest
provider of independent semiconductor manufacturing services in
assembly, test, materials and design manufacturing. As a global
leader geared towards meeting the industry's ever growing needs for
faster, smaller and higher performance chips, the Group develops
and offers a wide portfolio of technology and solutions including
IC test program design, front-end engineering test, wafer probe,
wafer bump, substrate design and supply, wafer level package, flip
chip, system-in-package, final test and electronic manufacturing
services through Universal Scientific Industrial Co., Ltd. and its
subsidiaries, members of the ASE Group. The Group generated sales
revenues of US$8.64 billion in 2015
and employs over 65,000 people worldwide. For more information
about the ASE Group, visit www.aseglobal.com.
About Deca Technologies
Founded in 2009 and launched
in November 2011, Deca Technologies
is an electronic interconnect solutions provider offering
wafer-level packaging (WLP) services to the semiconductor industry.
Headquartered in Tempe, Arizona,
and with global capabilities, Deca is a majority-owned and fully
independent subsidiary of Cypress Semiconductor Corp. (NASDAQ: CY).
Deca's mission is to deliver an exceptional customer experience
through its proprietary and transformative interconnect technology.
Integrating its solar and semiconductor background, Deca leverages
unique equipment, processes and operational methods to break down
traditional barriers in the continued adoption and growth of
next-generation wafer-level electronic interconnect. For more
information, please visit www.decatechnologies.com.
Cypress, the Cypress logo are registered trademarks of Cypress
Semiconductor Corp. Deca Technologies, the Deca logo are registered
trademarks and M-Series and Adaptive Patterning are trademarks of
Deca Technologies. All other trademarks are property of their
owners.
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SOURCE Cypress Semiconductor Corp.