ASE to Showcase System-in-Package Applications at Computex 2015
May 29 2015 - 3:00AM
Business Wire
Show suite to demonstrate IoT and
Connectivity using ASE SiP technology
Advanced Semiconductor Engineering, Inc (TAIEX:2311, NYSE:ASX),
the world’s largest semiconductor assembly and test service
provider, today announced it will be showcasing System in Package
(SiP) solutions in consumer applications at Computex 2015,
scheduled to take place in Taipei, Taiwan, over June 2-5, 2015.
These SiP applications highlight the synergy between ASE’s IC
packaging, material and test technologies, together with the strong
expertise of Universal Scientific Industrial Shanghai Co, Ltd (USI;
SHA: 601231) in module level manufacturing services to bring SiP
into the realm of the Internet-of-Things (IoT).
SiP technology enables multiple semiconductor chips and passive
components to be integrated within a smaller and more compact
module without compromising the functionality and performance of
the entire package or module. Hence, SiP can be ideally applied to
many of today’s consumer technologies that require heterogeneous
integration of numerous IC functions such as RF, processor, memory,
sensors, power management, multimedia, and more, within very tight
space constraints.
ASE’s developments in SiP also serve to protect the environment
as it reduces the number of required manufacturing steps.
Previously, each device function was developed onto individual IC
chips, but with SiP technology, the ICs can be designed and
directly embedded onto a substrate, then onto a module. The
reduction in manufacturing steps results in less required materials
as well as increased efficiency in logistics management during
inventory shipment.
To better serve the fast-growing IoT segment, ASE has evolved
its business model by combining its technologies in wire bonding,
wafer level, fan-out, flip chip, 2.5D/3D, substrates and embedded
IC packaging with USI’s module level assembly to establish a strong
leadership in SiP. ASE has also created a cohesive ecosystem for
its SiP platform that included a key announcement with Inotera
Memories Inc (April 7, 2014) on foundry service for 2.5D silicon
interposer and TDK Corporation (May 8, 2015) for proprietary
embedded substrate manufacturing. The collaboration within the
supply chain has led to the development of a world class
manufacturing technology that can be used in embedded solutions
within smartphones, wearables, homes, connectivity and sensor
applications.
Computex attendees will find the end result of this
collaboration on display in the ASE VIP suite which is located on
the second floor of the Taipei International Convention Center,
number T203A. The exhibits on display will include mesh lighting
(smart lighting) that can be controlled through an iPad,
environmental sensors, Beacon (micro location) technology,
wearables, connectivity and embedded substrate technology.
Attendees will have the opportunity to see how SiP solutions are
implemented into a variety of applications, including smart living,
connectivity, data management and diagnostic devices in
healthcare.
About ASE Group
Advanced Semiconductor Engineering, Inc. (ASE Group) is the
world's largest provider of independent semiconductor manufacturing
services in assembly, test, materials and design manufacturing. As
a global leader geared toward meeting the industry’s ever-growing
needs for faster, smaller and higher performance chips, ASE
develops and offers a wide portfolio of technology and solutions
including IC test program design, front-end engineering test, wafer
probe, wafer bump, substrate design and supply, wafer level
package, flip chip, SiP, final test and electronic manufacturing
services through Universal Scientific Industrial Co., Ltd. and its
subsidiaries, members of ASE Group. ASE generated sales revenues of
US $8.5 billion in 2014 and employs over 68,000 people worldwide.
For more information about ASE Group, visit www.aseglobal.com.
About Universal Scientific Industrial
(Shanghai) Co., Ltd.
Universal Scientific Industrial (Shanghai) Co., Ltd. is a global
ODM/EMS company providing design, miniaturization, material
sourcing, manufacturing, logistics, and after services of
electronic devices/modules for brand owners. As a member of ASE
Group, USI SH was founded in 2003 and listed in the Shanghai Stock
Exchange in 2012. With diversified and balanced offerings, plus
sales service network in North America, Europe, Japan, China,
Taiwan, as well as manufacturing sites in China, Taiwan and Mexico,
USI serves customers in the sectors of wireless communication,
computer and storage, consumer, industrial, and automotive
electronics worldwide. Visit USI web at www.usish.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20150529005166/en/
ASE Contacts:Evelyn Lu, +886 2 6636
5678evelyn_lu@aseglobal.comJennifer Yuen, +65 6631
4229jennifer.yuen@aseus.com
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