ams Schedules 2015 Multi-Project Wafer Starts for Analog Foundry Customers
November 17 2014 - 2:47AM
Business Wire
Unique combination of prototyping service plus chip scale
packaging offers large cost savings and great flexibility to
foundry customers
The Full Service Foundry division of ams AG (SIX: AMS), a
leading provider of high performance analog ICs and sensors, today
announced its fast and cost-efficient IC prototyping service, known
as Multi-Project Wafer (MPW) or shuttle run, with an updated
schedule for 2015. The prototyping service, which combines several
designs from different customers onto a single wafer, offers
significant cost advantages for foundry customers as the costs for
wafers and masks are shared among a number of different shuttle
participants.
As a further extension of its “More than Silicon” initiative,
ams now provides advanced packaging services to its shuttle
participants by offering WLCSP (Wafer Level Chip Scale Packaging)
on selected MPW runs within 2015. This unique combination of fast
prototyping service plus chip scale packaging offers large cost
savings and great flexibility to foundry customers.
ams’ best in class MPW service includes the whole range of
0.18μm and 0.35μm specialty processes. In order to provide leading
analog semiconductor process technologies, manufacturing and
services, ams offers four MPW runs in 0.18μm CMOS (C18) process as
well as four MPW runs in its advanced 0.18μm High-Voltage CMOS
(H18) technology supporting 1.8V, 5V, 20V and 50V devices. For the
0.35μm specialty processes, which are based on the 0.35μm CMOS
process transferred from TSMC (Taiwan Semiconductor Manufacturing
Company), a total of 14 runs are offered in 2015. ams' 0.35μm
High-Voltage CMOS process family, optimized for high-voltage
designs in automotive and industrial applications, supports 20V,
50V and 120V devices. The advanced High-Voltage CMOS process with
embedded EEPROM functionality as well as the 0.35μm SiGe-BiCMOS
technology S35 are fully compatible to the base CMOS base process
and complete ams’ MPW service portfolio.
Overall, ams will offer almost 150 MPW start dates in 2015,
enabled by long lasting co-operations with partner organizations
such as CMP, Europractice, Fraunhofer IIS and Mosis.
The complete schedule for 2015 has now been released and
detailed start dates per process are available on the web at
http://asic.ams.com/MPW.
To take advantage of the MPW service, ams’ foundry customers
deliver their completed GDSII-data on specific dates and receive
untested packaged samples or dies within a short lead-time of
typically 8 weeks for CMOS and 12 weeks for High-Voltage CMOS,
SiGe-BiCMOS and Embedded Flash processes.
All process technologies are supported by the well-known hitkit,
ams’ industry benchmark process design kit based on Cadence, Mentor
Graphics or Keysight ADS design environments. The hitkit comes
complete with fully silicon-qualified standard cells, periphery
cells and general purpose analog cells such as comparators,
operational amplifiers, low power A/D and D/A converters. Custom
analog and RF devices, physical verification rule sets for Assura
and Calibre, as well as precisely characterized circuit simulation
models, enable rapid design starts of complex high performance
mixed-signal ICs. In addition to standard prototype services, ams
also offers advanced analog IP blocks, a memory (RAM/ROM)
generation service and packaging services in ceramic or
plastic.
Download press picture and block diagram at
http://www.ams.com/eng/Press/Press-Releases/
ams AGPatricia MoosburgerMedia Relationsphone: +43 (0)
3136 500 31235press@ams.comwww.ams.com
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