Ultratech Receives Multiple-System Orders From Several Customers
for Advanced-Packaging Gold-Bump Lithography Tools
Multiple-System Orders From Taiwan and China Reinforce Ultratech's Leading
Gold-Bump Position
SAN JOSE, Calif., May 17 /PRNewswire-FirstCall/ -- Ultratech, Inc. (NASDAQ:UTEK), a leading supplier of lithography and laser-processing systems
used to manufacture semiconductors and nanotechnology devices, today announced
that it has received multiple-system orders from several customers in Taiwan
and China for its advanced-packaging (AP) lithography systems. Ultratech's
lithography systems are to be used for gold-bump processing for flat panel
displays (FPDs) and display-driver ICs for liquid crystal displays (LCDs) for
both consumer electronic devices and communication applications. The
escalating consumer demand for FPDs is creating an increase in demand for
Ultratech's AP gold-bump lithography tools. These multiple orders from several
global customers further solidify Ultratech's leadership position in the
gold-bump arena.
The increased demand for flat panel display applications is propelling the
growth of gold-bump lithography processing in Asia. According to TechSearch
International, a leading consulting and market research company, it is
anticipated that gold-bump capacity will increase by a total of 13 percent from
2005 through 2007.
Stephen Kay, Ultratech's director of marketing for advanced packaging
technology, noted, "As a gold-bump market leader, we are very pleased with the
recent rise in demand for AP lithography tools, especially in the FPD industry. We believe our orders have increased as a result of this escalating demand,
which is expected to increase gold bump fab utilization for the second half of
2005. According to global market intelligence firm, International Data
Corporation, there were 7.9 million LCD TVs sold last year and 2.6 million
plasma display panel TVs. As FPDs replace traditional displays, and LCD and
plasma TV screens continue to grow in size and popularity, gold-bump market
requirements for cost-effective, leading AP technology will increase to meet
the huge demand for consumer digital electronics. We remain committed to
providing enabling technology to meet our global customers' advanced
manufacturing requirements." Certain of the statements contained herein, which are not a historical fact and
which can generally be identified by words such as "anticipates," "expects,"
"intends," "will," "could," "believes," "estimates," "continue," and similar
expressions, are forward-looking statements under Section 27A of the Securities
Act of 1933, as amended, and Section 21E of the Securities Exchange Act of
1934, as amended, that involve risks and uncertainties, such as risks related
to Ultratech's dependence on new product introductions and market acceptance of
new products and enhanced versions of its existing products; lengthy sales
cycles, including the timing of system installations and acceptances; lengthy
and costly development cycles for laser-processing and lithography technologies
and applications; integration, development and associated expenses of the laser
processing operation; delays, deferrals and cancellations of orders by
customers; cyclicality in the semiconductor and nanotechnology industries;
pricing pressures and product discounts; high degree of industry competition;
intellectual property matters; expiration of licensing arrangements, and the
resulting adverse impact on Ultratech's licensing revenues; changes to
financial accounting standards; changes in pricing by Ultratech, its
competitors or suppliers; customer concentration; international sales; timing
of new product announcements and releases by Ultratech or its competitors;
ability to volume produce systems and meet customer requirements; sole or
limited sources of supply; ability and resulting costs to attract or retain
sufficient personnel to achieve Ultratech's targets for a particular period;
dilutive effect of employee stock option grants on net income per share, which
is largely dependent upon Ultratech achieving and maintaining profitability and
the market price of Ultratech's stock; mix of products sold; rapid
technological change and the importance of timely product introductions;
outcome of litigation; manufacturing variances and production levels; timing
and degree of success of technologies licensed to outside parties; product
concentration and lack of product revenue diversification; inventory
obsolescence; asset impairment; effects of certain anti-takeover provisions;
future acquisitions; volatility of stock price; business interruptions due to
natural disasters or utility failures; environmental regulations; and any
adverse effects of terrorist attacks in the United States or elsewhere, or
government responses thereto, or military actions in Iraq, Afghanistan and
elsewhere, on the economy, in general, or on Ultratech's business in
particular. Such risks and uncertainties are described in Ultratech's SEC
reports including its Annual Report on Form 10-K filed for the year ended
December 31, 2004 and its Quarterly Report on Form 10-Q for the quarter ended
April 2, 2005.
About Ultratech: Ultratech, Inc. designs, manufactures and markets
photolithography equipment used worldwide in the fabrication of semiconductor
and nanotechnology devices, and has expanded its technology scope in pioneering
laser processing technology for IC manufacturing. Founded in 1979, Ultratech
is a market leader in gold and solder bump lithography. Its products are
designed to substantially reduce the cost of ownership for manufacturers in the
electronics industry. The company's home page on the World Wide Web is located
at http://www.ultratech.com/. DATASOURCE: Ultratech, Inc.
CONTACT: Bruce R. Wright, Senior Vice President & CFO, or Laura Rebouche, Vice President, Investor Relations and Corporate Communications, , both of Ultratech, Inc., +1-408-321-8835, or fax, +1-408-577-3379; or Angie Kellen, Senior Account Manager of MCA, +1-650-968-8900, or fax, +1-650-968-8990, or , for Ultratech, Inc.
Web site: http://www.ultratech.com/
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