Tezzaron to Incorporate Rambus ReRAM Memory Technology
January 22 2015 - 5:00PM
Business Wire
Architecture enhances power and performance in
military, aerospace and commercial applications
Rambus Inc. (NASDAQ:RMBS) and Tezzaron Semiconductor today
announced that they have signed an agreement to incorporate Rambus
oxide-resistive memory (ReRAM) technology in forthcoming Tezzaron
devices. This architecture license gives Tezzaron access to system
IP, specifications and validation suites to design differentiated
chips using ReRAM, which is ideally suited to improve the power and
performance requirements in military, aerospace, and commercial
memory applications.
“Rambus is a great company to work with and their ReRAM
technology is a game-changer,” said Bob Patti, chief technology
officer at Tezzaron. “By implementing ReRAM in our unique 3D
architecture, we can revolutionize high-performance computing with
better endurance and superior power efficiency.”
“At Rambus we are continually developing comprehensive memory
solutions that take into account the evolving needs of an
increasingly diverse market,” said Gary Bronner, vice president of
Rambus Labs. “ReRAM fills the gap between what DRAM and Flash can
provide while being highly reliable and high speed. Collaboration
with Tezzaron takes full advantage of this new technology by
differentiating the memory architecture for numerous use cases
across the embedded landscape.”
Tezzaron plans to build ReRAM into storage-class 3D memory
devices for military, aerospace and commercial applications.
Tezzaron also plans to implement ReRAM in an assortment of SoCs,
FPGAs and processors to exploit the extensive split-fab production
experience of Tezzaron’s fabrication subsidiary, Novati
Technologies. Using ReRAM, Novati can add hundreds of megabytes of
storage to a logic device manufactured in a standard commercial
fab.
In addition to military and aerospace applications, ReRAM
technology can be utilized in a variety of embedded storage memory
devices where low power, design integration, cost and performance
are all important factors. Among these, the development of storage
memory in connected devices is fast becoming critical.
The first in Tezzaron’s family of ReRAM devices is currently in
design and is scheduled for production in 2016.
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About Rambus Inc.
Rambus brings invention to market. Our customizable IP cores,
architecture licenses, tools, services, and training improve the
competitive advantage of our customer’s products while accelerating
their time-to-market. Rambus products and innovations capture,
secure and move data. For more information, visit rambus.com.
RMBSTN
About Tezzaron Semiconductor
Tezzaron is a full service turn-key supplier of 3D and 2.5D
memory, memory subsystems and memory-intensive SoCs. Tezzaron
specializes in 3D wafer and die stacking, TSV processes and
wide-ranging collaborations, creating commercial parts as well as
custom devices for prototyping and production. For more
information, visit www.Tezzaron.com.
About Novati Technologies
Novati Technologies, a wholly owned subsidiary of Tezzaron, is
the premier innovation partner for accelerating nanotechnology
development and commercialization. Novati's proven advanced
technology and secure IP infrastructure, combined with its
recognized Technology Development Process, supports companies
developing MEMS, microfluidics, novel transistors, photovoltaics
and other nanotechnologies for the semiconductor, life sciences and
aerospace and defense markets. For more information, visit
www.Novati-Tech.com.
MSLGROUP for RambusSam Katzen,
415-512-0770rambus@mslgroup.com
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