PITTSBURGH, Sept. 29, 2014 /PRNewswire/ -- ANSYS
(NASDAQ: ANSS) announced today that its RedHawk™ and Totem™
products are certified for TSMC 16-nanometer (nm) FinFET+ (N16FF+),
a second-generation FinFET technology delivering power, performance
and area advantages over the previous generation. TSMC has
certified these solutions for static and dynamic voltage drop
analysis, electromigration (EM) verification and thermal
reliability with V0.9 of Design Rule Manual (DRM) and SPICE model,
and V1.0 certification is on track to be concluded by November 2014. In addition, TSMC and ANSYS have
been collaborating to enable power integrity and reliability for
TSMC 10-nanometer (N10) process technology. With N10 specific tool
enhancement implemented, customers can now use ANSYS tools to start
their designs in TSMC N10 technology.
FinFET technology is a three-dimensional transistor architecture
that results in higher-performing and lower power chips used in
mobile, computing and networking applications. Designs implemented
using these devices have complex metal geometry and higher drive
currents compared to planar FET, making power integrity and
electromigration key design requirements. Innovative algorithms
within RedHawk and Totem significantly reduce the memory footprint
and runtime performance to meet the increased computational
requirements caused by growing design complexity. These products
deliver accurate full-chip power analysis and expanded EM rules
support for system-on-chip (SoC) and mixed-signal design
sign-off.
"Certification of RedHawk and Totem in 16nm FinFET+ of ANSYS
tools enables chip designers to efficiently deliver more robust and
reliable SoC for the next generation of electronic products," said
Suk Lee, TSMC senior director,
design infrastructure marketing division.
In addition, FinFET architecture has higher local self-heating
caused by lower thermal conductivity of the substrate and
difficulty in heat dissipation due to narrow fins, which in turn
can impact the EM reliability of the design. RedHawk supports
TSMC's measurement-based self-heat model with micron-level
resolution, enabling thermal convergence.
"The ANSYS IC power solutions address power, noise and
reliability challenges for TSMC's most advanced process nodes and
design technologies," said Norman
Chang, vice president and senior product strategist at
ANSYS. "The certification of RedHawk and Totem for 16nm FinFET+
technology demonstrates how our products are delivering the
accuracy required for IR, EM and thermal sign-off for our mutual
customers."
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex
design challenges through fast, accurate and reliable engineering
simulation. Our technology enables organizations ― no matter their
industry ― to predict with confidence that their products will
thrive in the real world. Customers trust our software to help
ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs nearly 2,700
professionals, many of them expert in engineering fields such as
finite element analysis, computational fluid dynamics, electronics
and electromagnetics, and design optimization. Headquartered south
of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS also has a strong presence on the major social channels.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
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Contact
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Media
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Tom
Smithyman
724.514.3076
tom.smithyman@ansys.com
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Investors
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Annette
Arribas
724.514.1782
annette.arribas@ansys.com
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SOURCE ANSYS, Inc.