SHANGHAI, Oct. 23, 2014 /PRNewswire/ -- Semiconductor
Manufacturing International Corporation ("SMIC", NYSE: SMI, SEHK:
981) and Maxscend Technologies Inc., a RF IP company based in
China, announced that Maxscend
Bluetooth RF IP has been silicon proven on SMIC's 55nm Low Leakage
(LL) logic process. This IP has now been integrated into one of
SMIC customers' product tape-out.
The silicon proven Bluetooth RF IP is the result of a
collaborative effort between SMIC and Maxscend and marks a
significant milestone in SMIC RF IP platform setup. It has achieved
a leading edge position in the industry and will provide mutual
customers an excellent IP solution for the booming IoT market, as
well as the prosperous mobile and tablet markets.
Dr. Tianshen Tang, Senior Vice President of SMIC Design Service
Center commented, "We are pleased to be working with Maxscend. This
important breakthrough will enable SMIC to offer leading 55nm RF IP
solutions and secure SMIC's leading position in China's semiconductor foundry industry. We are
confident that we can provide top quality solutions and design
services for the customer."
"It is really exciting to see that our Bluetooth and
BLE RF IP has been silicon proven on
SMIC 55nm platform," said Zhihan Xu,
Chief Executive Officer of Maxscend. "Besides the current huge
demand of smart-phones, tablets, Bluetooth Audio and other areas of
traditional Bluetooth technologies, there is tremendous interest
coming from low-power Bluetooth in the IoT field. With the wide
adoption of Bluetooth low energy technology, smart devices will
become ubiquitous in everyday life: wearables, smart-home,
smart-medical, smart-sports and many more. By partnering with SMIC,
we are confident we have the capabilities to support global
customers with superior Bluetooth technology and professional
technical services."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC";
NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries
in the world and the largest and most advanced foundry in mainland
China. SMIC provides integrated
circuit (IC) foundry and technology services at 0.35-micron to
28-nanometer. Headquartered in Shanghai,
China, SMIC has a 300mm wafer fabrication facility (fab) and
a 200mm mega-fab in Shanghai; a
300mm mega-fab in Beijing and a
majority owned 300mm fab for advance nodes under development; a
200mm fab in Tianjin; and a 200mm
fab project under development in Shenzhen. SMIC also has marketing and customer
service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in
Hong Kong. For more information,
please visit www.smics.com.
Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)
This document contains, in addition to historical information,
"forward-looking statements" within the meaning of the "safe
harbor" provisions of the U.S. Private Securities Litigation Reform
Act of 1995. These forward-looking statements are based on SMIC's
current assumptions, expectations and projections about future
events. SMIC uses words like "believe," "anticipate," "intend,"
"estimate," "expect," "project" and similar expressions to identify
forward looking statements, although not all forward-looking
statements contain these words. These forward-looking statements
are necessarily estimates reflecting the best judgment of SMIC's
senior management and involve significant risks, both known and
unknown, uncertainties and other factors that may cause SMIC's
actual performance, financial condition or results of operations to
be materially different from those suggested by the forward-looking
statements including, among others, risks associated with
cyclicality and market conditions in the semiconductor industry,
intense competition, timely wafer acceptance by SMIC's customers,
timely introduction of new technologies, SMIC's ability to ramp new
products into volume, supply and demand for semiconductor foundry
services, industry overcapacity, shortages in equipment, components
and raw materials, availability of manufacturing capacity,
financial stability in end markets and intensive intellectual
property litigation in high tech industry.
In addition to the information contained in this document, you
should also consider the information contained in our other filings
with the SEC, including our annual report on Form 20-F filed with
the SEC on April 14, 2014, especially
in the "Risk Factors" section and such other documents that we may
file with the SEC or SEHK from time to time, including on Form 6-K.
Other unknown or unpredictable factors also could have material
adverse effects on our future results, performance or achievements.
In light of these risks, uncertainties, assumptions and factors,
the forward-looking events discussed in this document may not
occur. You are cautioned not to place undue reliance on these
forward-looking statements, which speak only as of the date stated
or, if no date is stated, as of the date of this document.
SMIC Contact Information:
English Media
Michael Cheung
Tel: +86-21-3861-0000 x16812
Email: Michael_Cheung@smics.com
Chinese Media
Jane Tang
Tel: +86-21-3861-0000 x10088
Email: Jane_Tang@smics.com
About Maxscend Technologies Inc.
Maxscend Technologies is an award-winning company in
China. We have a strong precedence
in RF CMOS design, and focus on developing mobile digital TV
chipsets as well as the licensing of Bluetooth/Wifi Connections and
RF IP. For further information please visit our company's website
www.maxscend.com.
Maxscend Contact Information:
Lifeng Zhou
Tel: +86-21-61006488 X8099
Email: lifeng.zhou@maxscend.com
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SOURCE Semiconductor Manufacturing International Corporation