Research and Markets (http://www.researchandmarkets.com/research/j9tbt4/electroless_copper)
has announced the addition of Woodhead Publishing Ltd's new book
"Electroless Copper and Nickel-phosphorus Plating: Processing,
Characterisation and Modelling" to their offering.
Unlike electroplating, electroless plating allows uniform deposits of
coating materials over all surfaces, regardless of size, shape and
electrical conductivity. Electroless copper and nickel-phosphorus
deposits provide protective and functional coatings in industries as
diverse as electronics, automotive, aerospace and chemical engineering.
This book discusses the latest research in electroless depositions.
Key features:
- written by leading experts in the field, this important book reviews
the deposition process and the key properties of electroless copper and
nickel-phosphorus deposits as well as their practical applications
- chapters review areas such as surface morphology and residual stress,
modelling surface structure, crystallisation of nickel-phosphorus
deposits and hardness evolution
- an invaluable guide for researchers studying electroless deposits or
materials science as well as for those working in the chemical, oil and
gas, automotive, electronics and aerospace industries
Key Topics Covered:
Introduction to electroless copper and nickel-phosphorus (Ni-P)
depositions
PART 1: ELECTROLESS COPPER DEPOSITIONS
Surface morphology evolution of electroless copper deposits
Cross-section of electroless copper deposits and the void fraction
Crystal structure and surface residual stress of electroless copper
deposits
The atomic model of the diamond pyramid structure in electroless copper
deposits
Molecular dynamics (MD) simulation of the diamond pyramid structure in
electroless copper deposits
Adhesion strength of electroless copper deposit to epoxy board
Electrical resistivity of electroless copper deposit
Applications of electroless copper deposits
PART 2: ELECTROLESS NICKEL-PHOSPHORUS (NI-P) DEPOSITIONS
Crystallisation of nickel-phosphorus deposits (Ni-P) with high
phosphorus content
Crystallisation of nickel-phosphorus deposits (Ni-P) with medium and low
phosphorus content
Modelling the thermodynamics and kinetics of crystallisation of
nickel-phosphorus (Ni-P) deposits
Artificial neural network (ANN) modelling of crystallisation
temperatures of nickel-phosphorus deposits
Hardness evolution of nickel-phosphorus (Ni-P) deposits with thermal
processing
Applications of electroless nickel-phosphorus (Ni-P) plating
For more information visit http://www.researchandmarkets.com/research/j9tbt4/electroless_copper
Source: Woodhead Publishing Ltd
