Rambus Introduces High Bandwidth Memory PHY on GLOBALFOUNDRIES FX-14™ ASIC Platform Using 14nm LPP Process Technology
February 07 2017 - 4:30PM
Business Wire
High-performance, power-efficient memory
solution designed for today’s data centers
Rambus Inc. (NASDAQ: RMBS) today announced the availability of
its High Bandwidth Memory (HBM) Gen2 PHY developed for
GLOBALFOUNDRIES high-performance FX-14TM ASIC Platform. Built on
the GLOBALFOUNDRIES 14nm FinFET (14LPP) process technology, the
Rambus HBM PHY is aimed at networking and data center applications
and designed for systems that require low latency and high
bandwidth memory. This PHY is fully compliant with the JEDEC HBM2
standard and supports data rates up to 2000 Mbps per data pin,
enabling a total bandwidth of 256 GB/s to meet the needs of today’s
most data-intensive tasks.
“Data center needs are continuously changing and we are at the
forefront of delivering memory interface technology designed to
meet today’s most demanding workloads,” said Luc Seraphin, senior
vice president and general manager of the Rambus Memory and
Interfaces division. “Through our collaboration with
GLOBALFOUNDRIES, we are delivering a comprehensive and robust
solution for high-performance data center and networking
applications. Our HBM offering will allow data center solution
developers to bring high performance memory closer to the CPU, thus
reducing latency and improving the system throughput.”
“With the rise of cloud computing and the growing needs of Big
Data, the computing power of data centers is burdened more than
ever and hardware manufacturers are being called upon to deliver
new solutions that can meet these challenges,” said Kevin
O’Buckley, vice president product development GLOBALFOUNDRIES.
“Working together with Rambus enables us to provide ASIC solutions
to our customers with increased memory capacity and bandwidth, with
improved power efficiency. This HBM innovation complements other
advanced chip to chip interfaces in our ASIC platform, including
our industry leading 56G Long Reach SerDes technology.”
The Rambus HBM PHY delivers high performance with lower power
consumption when compared to other memory solutions. It combines
2.5D packaging with a wider interface (1024 bits) at a lower clock
speed, which results in a higher overall throughput while remaining
energy efficient for even the most high-performance computing
applications. Rambus experts perform complete signal and power
integrity analysis on the entire 2.5D systems to ensure all signal
and thermal requirements are met.
The HBM PHY is another key component in Rambus’ memory and
SerDes high-speed interface IP portfolio for networking and data
center applications. For additional information on Rambus Memory
and Interfaces solutions, please visit
rambus.com/memory-and-interfaces.
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About Rambus Memory and Interfaces Division
The Rambus Memory and Interfaces division develops products and
services that solve the power, performance, and capacity challenges
of the communications and data center computing
markets. Rambus enhanced standards-compatible and custom
memory and serial link solutions include chips, architectures,
memory and SerDes interfaces, IP validation tools, and system and
IC design services. Developed through our system-aware design
methodology, Rambus products deliver improved
time-to-market and first-time-right quality.
About Rambus Inc.
Rambus creates innovative hardware and software technologies,
driving advancements from the data center to the mobile edge. Our
chips, customizable IP cores, architecture licenses, tools,
software, services, training and innovations improve the
competitive advantage of our customers. We collaborate with the
industry, partnering with leading ASIC and SoC designers,
foundries, IP developers, EDA companies and validation labs. Our
products are integrated into tens of billions of devices and
systems, powering and securing diverse applications, including Big
Data, Internet of Things (IoT), mobile, consumer and media
platforms. At Rambus, we are makers of better. For more
information, visit rambus.com.
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Rambus Inc.Agnes Toan, 408-462-8905Corporate
Communicationsatoan@rambus.com
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