Throughout Intel Corporation’s developer forum that starts today,
company executives emphasized the importance of collaborating with
China’s government and industry to help create new business and
innovation opportunities for Intel and its 14 million developers
worldwide. The management team detailed its vision of how such
collaborations could potentially spawn the next-generation of advances
in business, consumer electronics and many more industries around the
“The impact of major global trends, such as the rapidly growing middle
class as well as the explosive growth of connected, mobile Internet and
cloud computing traffic, is playing out ten-fold in China,” said Sean
Maloney, executive vice president of Intel Corporation and chairman of
For example, China became the largest PC market in the world last year,
growing a remarkable 13 percent in 2011 and now represents 20 percent of
all PC demand, according to IDC, a global industry analyst firm. In
addition, IDC shows servers in China are growing at more than eight
times the rate of the worldwide average over the past 5 years, making
the country the second-largest data center market segment in the world.
With more than 1 billion subscribers**, China is also the world’s
largest segment for mobile phones.
To address these and other opportunities, Intel executives speaking in
Beijing highlighted several technology advancements and local
collaborations designed to bring richer, more connected computing
experiences from the cloud to computing devices of all types.
The announcements included the introduction of Intel® Small Business
Advantage (SBA) designed to help maintain and protect PCs automatically
and improved visual experience with built-in visuals on Intel’s
forthcoming 3rd generation Intel Core products with Intel® HD
Graphics 2500/4000. The company also revealed that Intel Labs China will
work closely with leading Chinese OEMs, operators and municipalities for
ongoing technology research and development in China.
In his first speech since being appointed chairman of Intel China last
year, Maloney opened the company’s largest two-day technical conference
in Asia by noting how overcoming barriers in technology represents more
than just physics or engineering problem.
“As the world continues to advance, so too must semiconductor
technology, and that is never more evident than today with the pending
release of Tri-Gate transistors and 22 nm process technology,” said
Maloney. “Few individuals and industries will be untouched as powerful
microprocessors, Internet-connections, and user experience breakthroughs
are applied across the worlds of business, healthcare, education and the
society at large.”
Transforming the Personal Computing Experience
During his keynote presentation, Kirk Skaugen, vice president and
general manager of Intel’s PC Client Group discussed how Intel is
helping drive a dramatic change in the personal computing experience for
consumers and businesses with new hardware, software and solutions.
Ultrabook™ devices have already begun this transformation, and Skaugen
showcased numerous systems on stage and reiterated that more than 75
designs are planned for 2012 with many touch-enabled systems expected.
This next wave of Ultrabook devices, powered by 3rd generation
Intel® Core™ processors with Intel® HD Graphics 2500/4000, will
bring significant performance improvements for even greater computing
To address the small business segment without IT support, Skaugen also
announced Intel SBA will be available on the 2nd generation
Intel® Core™ processors. With Intel SBA, small businesses can
maximize business productivity by keeping PCs performing at an optimal
level while securing data by reducing the risk of virus disruptions,
leakage of confidential data and data loss. Intel SBA is a simple-to-use
integrated hardware and software solution that automatically provides
regular software updates, strengthens security defenses and conducts
maintenance tasks after-hours, even if the computer is turned off. OEMs
supporting the Intel Small Business Advantage solution include Asus*,
Dell*, Fujitsu* and Lenovo* as well as multiple local-OEMs around the
To help address online fraud, a common concern for consumers today, all
Ultrabook devices will now include Intel® Identity Protection
Technology, enabling a more secure and convenient way to access popular
websites2. Skaugen announced that RenRen*, China’s most
popular social networking website, will incorporate Intel Identity
Protection Technology as part of its focus on providing secure online
experience for its users. Additionally, he disclosed relationships with
Feitian Technologies* and DynamiCode Company*, both leading-edge second
factor authentication security solution services that will incorporate
Intel Identity Protection Technology into their products.
Collaborating for Datacenter and Cloud Success
During her keynote on the second day of the conference, Diane Bryant,
vice president and general manager of Intel’s Datacenter and Connected
Systems Group, will discuss how the rapid growth of users, devices and
data is transforming information technology while also creating new
opportunities for developers.
With more than 15 billion connected devices expected by 20153
– and the data center and cloud computing opportunities that support
this level of connected devices – Bryant will say the key is open,
standards-based solutions such as those defined by the Intel® Cloud
The Intel® Cloud Builders program enables ecosystem leaders to build and
optimize the cloud infrastructure using open-standard solutions
optimized for Intel architecture. Intel Cloud Builders brings together
tools and best practices, including more than 70 reference architectures
from a range of industry-leading cloud infrastructure systems and
solutions providers, to address key challenges facing data center and
cloud deployments such as security, manageability, and energy efficiency.
Bryant will share that the newly introduced Intel® Xeon processors are
at the heart of the data center. The Intel Xeon E5-2600 product family
is designed to scale and handle three times more data traffic than
today, be more efficient and secure. With 80 percent more performance1,4
and 50 percent more performance per wattpercent1,5 compared
to previous generations, the new Intel Xeon processors address the
requirements of an ever-growing connected world.
Intel has extended its leadership in data center technology and product
innovation with a strong and well-balanced portfolio of processors,
developer resources and support that addresses today’s workload
challenges for key segments, including the emerging micro server
category. Bryant will outline details of the company’s 2012 processor
roadmap for this category, and highlight how it continues to help
customers deliver new levels of power efficiency and density while
allowing them to also benefit from common software compatibility across
Intel-based micro servers and traditional servers.
Intel Labs China: Aligning Research Collaboration and Innovation
Emphasizing the importance of ongoing research with local partners in
China, Intel Labs announced new joint research collaboration efforts
with Lenovo* and China Mobile*. Intel and Lenovo’s new lab-to-lab
collaborative research efforts will address challenges in the mobile
Internet area, such as security, context aware computing, cross screen
experience and energy efficiency.
The China Mobile Research Institute (CMRI) is applying Intel
architecture to wireless base stations to power next-generation mobile
network infrastructure. As part of CMRI’s Cooperative Radio Access
Architecture (CRAN) vision, Intel Labs China and CMRI are engaging in
research and ecosystem development to increase the speed and efficiency
telecommunications networks through greater processing power and general
computing capabilities. With CMRI and other ecosystem partners, Intel
has produced a reference design prototype that demonstrates considerable
improvements for lowering total cost of ownership. For example, IA
signal processing-enabled CRAN technology can save telecommunications
operators up to 15 percent in capital expenditures and reduce operations
costs up to 50 percent, largely through power savings.
Intel Developer Forum
IDF spans the worlds of mobility, digital enterprise, digital home, and
technology and research. Held at the China National Convention Center on
April 11-12, the event is geared toward the Chinese market in support of
local innovation and Intel’s industry leadership in the region. Next up
on the IDF schedule is a one-day conference in Brazil on May 15 and a
3-day event in San Francisco, which will be held Sept. 11-13 at Moscone
Center West. Further information is available at www.intel.com/idf.
Intel (NASDAQ: INTC) is a world leader in computing innovation. The
company designs and builds the essential technologies that serve as the
foundation for the world’s computing devices. Additional information
about Intel is available at newsroom.intel.com
Intel, Intel Core, Intel Xeon, Ultrabook and the Intel logo are
trademarks of Intel Corporation in the United States and other countries.
* Other names and brands may be claimed as the property of others.
** China Ministry of Industry and Information Technology
1 Software and workloads used in performance tests may have been
optimized for performance only on Intel microprocessors. Performance
tests, such as SYSmark and MobileMark, are measured using specific
computer systems, components, software, operations and functions. Any
change to any of those factors may cause the results to vary. You should
consult other information and performance tests to assist you in fully
evaluating your contemplated purchases, including the performance of
that product when combined with other products. For more information go
2 IPT disclaimer: No system can provide absolute security under all
conditions. Requires an Intel® Identity Protection Technology-enabled
system, including a 2nd gen Intel® Core™ processor enabled chipset,
firmware and software, and participating website. Consult your system
manufacturer. Intel assumes no liability for lost or stolen data and/or
systems or any resulting damages. For more information, visit http://ipt.intel.com.
3 (Connect devices) Source: “Worldwide Device Estimates Year 2020 -
Intel One Smart Network Work” forecast
4 (Generational Performance) Source: Performance comparison using best
submitted/published 2-socket server results on the SPECfp*_rate_base2006
benchmark as of 6 March 2012. Baseline score of 271 published by Itautec
on the Servidor Itautec MX203* and Servidor Itautec MX223* platforms
based on the prior generation Intel® Xeon® processor X5690. New score of
492 submitted for publication by Dell on the PowerEdge T620 platform and
Fujitsu on the PRIMERGY RX300 S7* platform based on the Intel® Xeon®
processor E5-2690. For additional details, please visit www.spec.org.16.
5 (Energy Efficient Performance) Source: Performance comparison using
best submitted/published 2-socket single-node server results on the
SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline score of 3,329
ssj*_ops/watt published by Hewlett-Packard on the ProLiant DL360 G7*
platform based on the prior generation Intel® Xeon® processor X5675.
Score of 5,093 ssj*_ops/watt submitted for publication by Fujitsu on the
PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor E5-2660.
For additional details, please visit www.spec.org.1,16.