Throughout Intel Corporation’s developer forum that starts
today, company executives emphasized the importance of
collaborating with China’s government and industry to help create
new business and innovation opportunities for Intel and its 14
million developers worldwide. The management team detailed its
vision of how such collaborations could potentially spawn the
next-generation of advances in business, consumer electronics and
many more industries around the globe.
“The impact of major global trends, such as the rapidly growing
middle class as well as the explosive growth of connected, mobile
Internet and cloud computing traffic, is playing out ten-fold in
China,” said Sean Maloney, executive vice president of Intel
Corporation and chairman of Intel China.
For example, China became the largest PC market in the world
last year, growing a remarkable 13 percent in 2011 and now
represents 20 percent of all PC demand, according to IDC, a global
industry analyst firm. In addition, IDC shows servers in China are
growing at more than eight times the rate of the worldwide average
over the past 5 years, making the country the second-largest data
center market segment in the world. With more than 1 billion
subscribers**, China is also the world’s largest segment for mobile
phones.
To address these and other opportunities, Intel executives
speaking in Beijing highlighted several technology advancements and
local collaborations designed to bring richer, more connected
computing experiences from the cloud to computing devices of all
types.
The announcements included the introduction of Intel® Small
Business Advantage (SBA) designed to help maintain and protect PCs
automatically and improved visual experience with built-in visuals
on Intel’s forthcoming 3rd generation Intel Core products with
Intel® HD Graphics 2500/4000. The company also revealed that Intel
Labs China will work closely with leading Chinese OEMs, operators
and municipalities for ongoing technology research and development
in China.
In his first speech since being appointed chairman of Intel
China last year, Maloney opened the company’s largest two-day
technical conference in Asia by noting how overcoming barriers in
technology represents more than just physics or engineering
problem.
“As the world continues to advance, so too must
semiconductor technology, and that is never more evident than today
with the pending release of Tri-Gate transistors and 22 nm process
technology,” said Maloney. “Few individuals and industries will be
untouched as powerful microprocessors, Internet-connections, and
user experience breakthroughs are applied across the worlds of
business, healthcare, education and the society at large.”
Transforming the Personal Computing Experience
During his keynote presentation, Kirk Skaugen, vice president
and general manager of Intel’s PC Client Group discussed how Intel
is helping drive a dramatic change in the personal computing
experience for consumers and businesses with new hardware, software
and solutions. Ultrabook™ devices have already begun this
transformation, and Skaugen showcased numerous systems on stage and
reiterated that more than 75 designs are planned for 2012 with many
touch-enabled systems expected. This next wave of Ultrabook
devices, powered by 3rd generation Intel®
Core™ processors with Intel® HD Graphics 2500/4000, will bring
significant performance improvements for even greater computing
experiences.
To address the small business segment without IT support,
Skaugen also announced Intel SBA will be available on the 2nd
generation Intel® Core™ processors. With Intel SBA, small
businesses can maximize business productivity by keeping PCs
performing at an optimal level while securing data by reducing the
risk of virus disruptions, leakage of confidential data and data
loss. Intel SBA is a simple-to-use integrated hardware and software
solution that automatically provides regular software updates,
strengthens security defenses and conducts maintenance tasks
after-hours, even if the computer is turned off. OEMs supporting
the Intel Small Business Advantage solution include Asus*, Dell*,
Fujitsu* and Lenovo* as well as multiple local-OEMs around the
world.
To help address online fraud, a common concern for consumers
today, all Ultrabook devices will now include Intel® Identity
Protection Technology, enabling a more secure and convenient way to
access popular websites2. Skaugen announced that RenRen*, China’s
most popular social networking website, will incorporate Intel
Identity Protection Technology as part of its focus on providing
secure online experience for its users. Additionally, he disclosed
relationships with Feitian Technologies* and DynamiCode Company*,
both leading-edge second factor authentication security solution
services that will incorporate Intel Identity Protection Technology
into their products.
Collaborating for Datacenter and Cloud Success
During her keynote on the second day of the conference, Diane
Bryant, vice president and general manager of Intel’s Datacenter
and Connected Systems Group, will discuss how the rapid growth of
users, devices and data is transforming information technology
while also creating new opportunities for developers.
With more than 15 billion connected devices expected by 20153 –
and the data center and cloud computing opportunities that support
this level of connected devices – Bryant will say the key is
open, standards-based solutions such as those defined by the Intel®
Cloud Builders Program.
The Intel® Cloud Builders program enables ecosystem leaders to
build and optimize the cloud infrastructure using open-standard
solutions optimized for Intel architecture. Intel Cloud Builders
brings together tools and best practices, including more than 70
reference architectures from a range of industry-leading cloud
infrastructure systems and solutions providers, to address key
challenges facing data center and cloud deployments such as
security, manageability, and energy efficiency.
Bryant will share that the newly introduced Intel® Xeon
processors are at the heart of the data center. The Intel Xeon
E5-2600 product family is designed to scale and handle three times
more data traffic than today, be more efficient and secure. With 80
percent more performance1,4 and 50 percent more performance per
wattpercent1,5 compared to previous generations, the new Intel Xeon
processors address the requirements of an ever-growing connected
world.
Intel has extended its leadership in data center technology and
product innovation with a strong and well-balanced portfolio of
processors, developer resources and support that addresses today’s
workload challenges for key segments, including the emerging micro
server category. Bryant will outline details of the company’s 2012
processor roadmap for this category, and highlight how it continues
to help customers deliver new levels of power efficiency and
density while allowing them to also benefit from common software
compatibility across Intel-based micro servers and traditional
servers.
Intel Labs China: Aligning Research Collaboration and
Innovation
Emphasizing the importance of ongoing research with local
partners in China, Intel Labs announced new joint research
collaboration efforts with Lenovo* and China Mobile*. Intel and
Lenovo’s new lab-to-lab collaborative research efforts will address
challenges in the mobile Internet area, such as security, context
aware computing, cross screen experience and energy efficiency.
The China Mobile Research Institute (CMRI) is applying Intel
architecture to wireless base stations to power next-generation
mobile network infrastructure. As part of CMRI’s Cooperative Radio
Access Architecture (CRAN) vision, Intel Labs China and CMRI are
engaging in research and ecosystem development to increase the
speed and efficiency telecommunications networks through greater
processing power and general computing capabilities. With CMRI and
other ecosystem partners, Intel has produced a reference design
prototype that demonstrates considerable improvements for lowering
total cost of ownership. For example, IA signal processing-enabled
CRAN technology can save telecommunications operators up to 15
percent in capital expenditures and reduce operations costs up to
50 percent, largely through power savings.
Intel Developer Forum
IDF spans the worlds of mobility, digital enterprise, digital
home, and technology and research. Held at the China National
Convention Center on April 11-12, the event is geared toward the
Chinese market in support of local innovation and Intel’s industry
leadership in the region. Next up on the IDF schedule is a one-day
conference in Brazil on May 15 and a 3-day event in San Francisco,
which will be held Sept. 11-13 at Moscone Center West. Further
information is available at www.intel.com/idf.
About Intel
Intel (NASDAQ: INTC) is a world leader in computing innovation.
The company designs and builds the essential technologies that
serve as the foundation for the world’s computing devices.
Additional information about Intel is available at
newsroom.intel.com and blogs.intel.com.
Intel, Intel Core, Intel Xeon, Ultrabook and the Intel logo are
trademarks of Intel Corporation in the United States and other
countries.
* Other names and brands may be claimed as the property of
others.
** China Ministry of Industry and Information Technology
1 Software and workloads used in performance tests may have been
optimized for performance only on Intel microprocessors.
Performance tests, such as SYSmark and MobileMark, are measured
using specific computer systems, components, software, operations
and functions. Any change to any of those factors may cause the
results to vary. You should consult other information and
performance tests to assist you in fully evaluating your
contemplated purchases, including the performance of that product
when combined with other products. For more information go to
www.intel.com/performance
2 IPT disclaimer: No system can provide absolute security under
all conditions. Requires an Intel® Identity Protection
Technology-enabled system, including a 2nd gen Intel® Core™
processor enabled chipset, firmware and software, and participating
website. Consult your system manufacturer. Intel assumes no
liability for lost or stolen data and/or systems or any resulting
damages. For more information, visit http://ipt.intel.com.
3 (Connect devices) Source: “Worldwide Device Estimates Year
2020 - Intel One Smart Network Work” forecast
4 (Generational Performance) Source: Performance comparison
using best submitted/published 2-socket server results on the
SPECfp*_rate_base2006 benchmark as of 6 March 2012. Baseline score
of 271 published by Itautec on the Servidor Itautec MX203* and
Servidor Itautec MX223* platforms based on the prior generation
Intel® Xeon® processor X5690. New score of 492 submitted for
publication by Dell on the PowerEdge T620 platform and Fujitsu on
the PRIMERGY RX300 S7* platform based on the Intel® Xeon® processor
E5-2690. For additional details, please visit www.spec.org.16.
5 (Energy Efficient Performance) Source: Performance comparison
using best submitted/published 2-socket single-node server results
on the SPECpower_ssj*2008 benchmark as of 6 March 2012. Baseline
score of 3,329 ssj*_ops/watt published by Hewlett-Packard on the
ProLiant DL360 G7* platform based on the prior generation Intel®
Xeon® processor X5675. Score of 5,093 ssj*_ops/watt submitted for
publication by Fujitsu on the PRIMERGY RX300 S7* platform based on
the Intel® Xeon® processor E5-2660. For additional details, please
visit www.spec.org.1,16.
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