Applied Materials, Inc. and the Institute of Microelectronics
(IME), a world-renowned research institute under the Agency for
Science, Technology and Research (A*STAR), today announced a
five-year extension of their research collaboration at the Centre
of Excellence in Advanced Packaging in Singapore. The organizations
will expand the scope of their R&D collaboration to focus on
advancing Fan-Out Wafer-Level Packaging (FOWLP), a key technology
inflection expected to help make chips and end-user devices
smaller, faster and more power efficient.
With an anticipated additional S$188 million of
combined investment, the Centre will expand to a second location at
Fusionopolis 2, in addition to the existing facility at Singapore’s
Science Park II. The two facilities combined will span an area of
approximately 1,700 square meters and be staffed by a team of close
to 100 researchers, scientists and engineers. The Centre was built
to develop new capabilities in advanced packaging through a full
line of Applied Materials’ Wafer-Level Packaging (WLP) processing
equipment, and has successfully delivered advancements in
semiconductor hardware, process and device structures.
“Our collaboration with A*STAR over the past five
years has been instrumental in establishing Applied Materials’
presence in Singapore and building up our R&D capabilities,”
said Russell Tham, Regional President, Applied Materials South East
Asia. “With the entire R&D value stream from ideation to
product development being carried out locally via this joint lab,
the expansion will further Applied Materials’ development of new
technologies and products for global markets, while remaining a key
contributor to Singapore’s innovation economy.”
Dr. Raj. Thampuran, Managing Director, A*STAR,
said, “Our relationship with Applied Materials transcends a new
milestone with the extension of our collaboration in R&D into
new areas. The progress we have made from our initial collaboration
is a testament to the successful partnership A*STAR has with
Applied Materials. As we look towards the future, we remain
committed to advancing innovations in the semiconductor industry
and being at the forefront of leading edge ideas in this rapidly
evolving technological landscape.”
The Internet of Things (IoT) and Big Data are
driving forces in today’s market of interconnected and
multi-functional electronic devices. FOWLP is considered a key
technology platform for system scaling, enabling multiple chips to
be integrated in a small form factor on a single package. With
FOWLP capable of providing significant benefits for the mobile and
wireless markets, increased investment in the sector could help
propel Singapore’s standing as a global hub for semiconductor
R&D. Through a successful alliance with its private sector
partners across the value chain, A*STAR has contributed to
Singapore’s vibrant research, innovation and enterprise ecosystem.
In 2014, A*STAR and 10 other industry partners launched four
Advanced Semiconductor Joint Labs to provide an integrated platform
for complex microchip manufacturing R&D. These global
partnerships together with the Applied Materials – A*STAR joint
R&D Centre will continue to strengthen Singapore’s capabilities
in semiconductor R&D and contribute to the creation of
high-value jobs and competitiveness of the industry.
The Singapore Centre conducts WLP research across
Applied Materials for its global customers. The Centre undertakes
complex multi-disciplinary research to develop new innovations in
advanced packaging including bump, TSV, 2.5D interposers and now
FOWLP. Through its work at the Centre, Applied Materials has
developed technology that has been successfully implemented in
several of its semiconductor equipment products. In addition, the
extension of the collaboration highlights the important role a
successful public-private partnership plays in creating value and
building up differentiated competencies for Singapore.
“Applied Materials’ leading expertise in materials
engineering drives the development of highly differentiated
products and solutions that make new technologies possible,” said
Dr. Prabu Raja, Group Vice President and General Manager of the
Patterning and Packaging Group, Applied Materials. “We are excited
to expand our collaboration with A*STAR and leverage our
complementary strengths to solve challenges in advanced packaging
and build new capabilities for future innovations.”
A*STAR takes a long-term vision towards strategic
investments in industry-ready R&D that contribute to
Singapore’s economic growth. It is home to one of the premier
advanced packaging and wafer-level packaging research facilities in
Asia. IME’s leading research capabilities in advanced chip
packaging are focused on meeting the challenging requirements in
complex and sophisticated chip packaging, in order to develop
slimmer devices with greater system capabilities such as ultra-low
power consumption, increased memory and bandwidth, and diverse
functionality.
Dr. Tan Yong Tsong, Executive Director, IME, said,
“Our long standing collaboration with Applied Materials
demonstrates the value of public-private partnership under open
innovation, and underscores the readiness and competitiveness of
IME’s research capabilities for the industry. Through this joint
lab, we will continue to push the envelope through our
differentiated R&D competencies to deliver breakthrough
technologies.”
About Applied Materials, Inc.
Applied Materials, Inc. (Nasdaq:AMAT) is the leader
in materials engineering solutions used to produce virtually every
new chip and advanced display in the world. Our expertise in
modifying materials at atomic levels and on an industrial scale
enables customers to transform possibilities into reality. At
Applied Materials, our innovations make possible the technology
shaping the future. Learn more at www.appliedmaterials.com.
About the A*STAR Institute of
Microelectronics (IME)
The Institute of Microelectronics (IME) is a
research institute of the Science and Engineering Research Council
of the Agency for Science, Technology and Research (A*STAR).
Positioned to bridge the R&D between academia and industry,
A*STAR IME's mission is to add value to Singapore's semiconductor
industry by developing strategic competencies, innovative
technologies and intellectual property; enabling enterprises to be
technologically competitive; and cultivating a technology talent
pool to inject new knowledge to the industry. Its key research
areas are in integrated circuits design, advanced packaging,
bioelectronics and medical devices, MEMS, nanoelectronics, and
photonics.
For more information about IME, please
visit www.ime.a-star.edu.sg.
About the Agency for Science, Technology
and Research (A*STAR)
The Agency for Science, Technology and Research
(A*STAR) is Singapore's lead public sector agency that spearheads
economic oriented research to advance scientific discovery
and develop innovative technology. Through open innovation, we
collaborate with our partners in both the public and private
sectors to benefit society.
As a Science and Technology Organisation, A*STAR
bridges the gap between academia and industry. Our research creates
economic growth and jobs for Singapore, and enhances lives by
contributing to societal benefits such as improving outcomes in
healthcare, urban living, and sustainability.
We play a key role in nurturing and developing a
diversity of talent and leaders in our Agency and Research
Institutes, the wider research community and industry. A*STAR
oversees 18 biomedical sciences and physical sciences and
engineering research entities primarily located in Biopolis and
Fusionopolis.
For more information on A*STAR, please visit
www.a-star.edu.sg.
Editorial/Media Contacts
Applied Materials:
Kevin Winston (USA)
+1 (408) 235-4498
kevin_winston@amat.com
Seraphina Seng (Singapore)
+65 63117531
seraphina_seng@amat.com
Institute of Microelectronics:
Lynn Hong
Agency for Science, Technology and Research
+65 6419 6597
hongxl@scei.a-star.edu.sg
Investor Relations Contact
Applied Materials:
Michael Sullivan
+1 (408) 986-7977
michael_sullivan@amat.com
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