CHANDLER, Ariz. and
DALLAS, July 7 /PRNewswire/ -- Amkor Technology, Inc.
(Nasdaq: AMKR) and Texas Instruments Incorporated (TI) (NYSE: TXN)
today announced they have qualified and begun production of the
industry's first fine pitch copper pillar flip chip packages –
shrinking bump pitch up to 300 percent compared to current solder
bump flip chip technology. Co-developed to lower the packaging
costs of integrated circuit (IC) devices with fine pitch
input/output (I/O) pad structures of less than 50 microns (um), the
proprietary technology platform also boosts performance, making it
ideal for wireless and embedded processing applications based on
plated copper pillar bumping and assembly technology.
"As chip I/O density increases with each process node, we had to
find a way to decrease the distance between pins," said
Tom Thorpe, TI vice president and
manager of external development and manufacturing (EDM). "Working
together, Amkor and TI rapidly developed, qualified and deployed a
new package platform that will not only address TI's flip chip
package needs for the next decade but will also serve as a game
changer for the industry. This new packaging technology will drive
down the size and cost of semiconductors while boosting performance
– a win for TI, Amkor and our customers."
"Amkor and TI worked tirelessly to bring this complex technology
to market against a challenging development timeline," said
Ken Joyce, president and CEO of
Amkor Technology. "Both organizations mobilized significant
resources to advance the state of the art for copper pillar
bumping, fine pitch interconnect assembly, and advanced packaging.
We are committed to partnering with TI in applying this new
technology on chip scale packages (CSP), conventional package on
package (PoP), and next generation TMV™ PoP configurations."
About Fine Pitch Flip Chip with Copper Pillar
Technologies
This new lead free technology enables the use of flip chip
interconnection at fine pad pitches (50 um and smaller) using fine
pitch copper pillar bumping and a newly developed assembly process.
Additionally, this technology acts as the platform interconnect
technology for integration with next generation advanced silicon
nodes.
The fine pitch flip chip layout design methodology typically
reduces substrate layer count as compared to standard area array
flip chip, yielding a low cost package solution. The fine pitch
flip chip package was developed for very thin die, which, when
combined with the low standoff height of the copper pillar bump
itself, reduces package height.
About Amkor
Amkor is a leading provider of semiconductor assembly and test
services to semiconductor companies and electronics OEMs. More
information on Amkor is available from the company's SEC filings
and on Amkor's website: www.amkor.com
About Texas Instruments
Texas Instruments (NYSE: TXN) helps customers solve problems and
develop new electronics that make the world smarter, healthier,
safer, greener and more fun. A global semiconductor company, TI
innovates through design, sales and manufacturing operations in
more than 30 countries. For more information, go to www.ti.com.
Forward-Looking Statement Disclaimer
This press release contains forward-looking statements within
the meaning of federal securities laws. All statements other than
statements of historical fact are considered forward-looking
statements including, without limitation, statements regarding the
use of fine pitch copper pillar packaging in TI products, and
reductions in the size and cost of semiconductors. Important
risk factors that could affect the outcome of the events set forth
or implied in these statements and that could affect the operating
results and financial conditions of either Amkor or TI are
discussed in the companies' respective Annual Reports on Form 10-K
for the year ended December 31, 2009
and in the subsequent filings with the Securities and Exchange
Commission made prior to or after the date hereof. Neither company
undertakes any obligation to review or update any forward-looking
statements to reflect events or circumstances occurring after the
date of this release.
SOURCE Texas Instruments Incorporated; Amkor Technology,
Inc.