Amkor Technology Takes Leadership Position in Advanced System-in-Package Market
March 23 2016 - 8:45PM
Business Wire
Amkor Technology Inc. (Nasdaq: AMKR), a leading semiconductor
packaging and test service provider, today announced it has shipped
700 million RF and front-end advanced system-in-package (SiP)
modules for mobile device applications. This achievement
establishes Amkor’s leadership in delivering low-cost,
high-performance advanced SiP solutions.
“Reaching this milestone affirms our leadership role in advanced
SiP technologies,” said Steve Kelley, CEO and President of Amkor
Technology Inc. “Our broad technology portfolio and
engineering talent make Amkor an excellent choice for customers
seeking high-performance, miniaturized solutions. In addition to
building today’s laminate-based SiPs, we are also developing
wafer-level SiP technology to enable the next generation of
thinner, higher-performance electronic products.”
An advanced SiP module is composed of multiple semiconductor
components with different functionalities which are combined into a
single integrated circuit ("IC") package. Advanced SiPs allow
designers to squeeze more functionality into a smaller space, while
increasing system performance and lowering system power
consumption. Advanced SiPs use a variety of interconnect
technologies including wire-bond, flip chip, copper pillars and
through silicon vias (TSVs).
Amkor’s laminate-based SiPs are manufactured in high volumes and
have fast cycle-time, making them very cost-effective. The
company’s wafer-based Silicon Wafer Integrated Fan-out (SWIFT™) and
Silicon-less Integrated Module (SLIM™) technologies provide thinner
packages at finer line/space geometries and higher densities than
laminate-based SiPs. Both SWIFT and SLIM offer a lower-cost
alternative to TSV-based 2.5D and 3D packaging.
About Amkor Technology Inc.
Amkor Technology Inc. is one of the world’s largest providers of
outsourced semiconductor packaging and test services. Founded in
1968, Amkor pioneered the outsourcing of IC packaging and test, and
is now a strategic manufacturing partner for more than 250 of the
world’s leading semiconductor companies, foundries and electronics
OEMs. Amkor’s operational base encompasses more than 8 million
square feet of floor space, with production facilities, product
development centers, and sales and support offices located in key
electronics manufacturing regions in Asia, Europe and the U.S. For
more information, visit www.amkor.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20160323006642/en/
Investor RelationsGreg JohnsonSenior Director, Finance
and Investor RelationsAmkor
Technology480-786-7594greg.johnson@amkor.com
Media RelationsAmy SmithImpress Labs401-
369-9266amy@impresslabs.com
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