Amkor Technology Licenses Proprietary Copper Pillar Wafer Bump Technology to GLOBALFOUNDRIES
December 16 2014 - 01:00PM
Business Wire
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of
semiconductor assembly and test services, today announced that it
has granted GLOBALFOUNDRIES a non-exclusive license to its
proprietary copper pillar wafer bump technology. The agreement
provides for the transfer of Amkor’s copper pillar wafer bump
technology to GLOBALFOUNDRIES and a license under Amkor’s
intellectual property to enable GLOBALFOUNDRIES to bump wafers
based on this technology.
“Technology leadership and innovation are fundamental to Amkor’s
success. Since its introduction in 2010, our proprietary copper
pillar wafer bump technology has been widely adopted for use in
high volume production in many applications, including the
smartphone and tablet markets,” said Dr. Choon Heung Lee, Amkor’s
executive vice president and chief technology officer. “We are
pleased to license our copper pillar wafer bump technology to
GLOBALFOUNDRIES, a world class, leading edge foundry.”
“GLOBALFOUNDRIES is committed to providing customers of our
leading edge fab technology with fully integrated solutions.
Silicon to package integration is a key component of these
solutions and we are pleased to have partnered with Amkor, a
technology leader for outsourced semiconductor packaging and test
services, to expand our wafer bumping services to include
capabilities that can further extend our copper pillar bump
manufacturing,” said David McCann, Vice President of Packaging
R&D at GLOBALFOUNDRIES. “Semiconductor device scaling drives
higher density off chip interconnect requirements. Copper pillar
bumping is a critical part of bringing leading edge semiconductor
devices to market and this capability enhances our growing open
ecosystem of manufacturing services and partners.”
Amkor’s copper pillar wafer bump technology enables low profile
and small area packaging, which is required for the mobile device
market. Copper pillar technology supports 3D fine pitch memory
interfaces and is utilized in 2.5D packaging where fine pitch
multi-die interconnects can reduce system level costs and shorten
time-to-market as compared to SoC platforms. In addition, Amkor’s
copper pillar wafer bump technology supports substantial die-to-die
bandwidth between memory and logic devices, greatly reduces power
consumption in high-performance products, and enables high speed
interfaces when applied to analog and RF applications.
About Amkor
Amkor is a leading provider of semiconductor packaging and test
services to semiconductor companies and electronics OEMs. More
information on Amkor is available from the company's SEC filings
and at Amkor's website: www.amkor.com
Amkor Technology, Inc.Greg JohnsonSr. Director, Investor
Relations and Corporate
Communications480-786-7594greg.johnson@amkor.com
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