Amkor Completes Product Qualification of SWIFT™ Packaging for Advanced Mobile, Networking and SiP Applications
December 14 2016 - 9:30AM
Business Wire
Amkor Technology, Inc. (Nasdaq: AMKR) today announced completion
of product qualification for its innovative new Silicon Wafer
Integrated Fan-Out Technology (SWIFT™). SWIFT is designed to handle
the demanding requirements of today’s advanced mobile, networking
and system-in-package (SiP) applications.
With its fine-feature photolithography and thin film
dielectrics, SWIFT bridges the gap between through silicon via
(TSV) and traditional wafer level fan-out (WLFO) packages. Compared
to laminate-based substrate technologies, SWIFT offers dramatic
improvements in form factor, signal integrity, power distribution
and thermal performance. SWIFT incorporates an “RDL first” process
that allows SWIFT wafers to be built and yielded ahead of the
assembly process - accelerating production cycles and optimizing
overall assembly yield.
“The semiconductor industry requires much higher levels of
integration in a significantly reduced form factor,” said Ron
Huemoeller, Amkor’s corporate vice president, Research &
Development. “Completing the product qualification stage of SWIFT
is an important milestone. We achieved success by leveraging our
significant fan-out development experience and using our existing
cutting-edge equipment. Our package and board-level reliability
results demonstrate that SWIFT is ready for sampling by
customers.”
SWIFT was named the “Device of the Year” at the 3D InCites
Awards ceremony earlier this year. It was recognized for being
“uniquely developed to deliver a high yielding, high-performance
package with the thinnest profile in the industry.” SWIFT was also
noted for its ability to deliver 2µm line/space lithography (with
up to four layers of RDL) and a very dense network of memory
interface vias at a very competitive price.
SWIFT is targeted for production in the second half of 2017 at
K5, Amkor’s state-of-the-art manufacturing, research and
development center in Incheon, South Korea.
About Amkor Technology
Amkor Technology, Inc. is one of the world’s largest providers
of outsourced semiconductor packaging and test services. Founded in
1968, Amkor pioneered the outsourcing of IC packaging and test, and
is now a strategic manufacturing partner for more than 250 of the
world’s leading semiconductor companies, foundries and electronics
OEMs. Amkor’s operational base includes more than 8 million square
feet of floor space with production facilities, product development
centers, and sales and support offices located in key electronics
manufacturing regions in Asia, Europe and the U.S. For more
information, visit www.amkor.com.
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version on businesswire.com: http://www.businesswire.com/news/home/20161214005291/en/
Media Contact:Debi PoloAmkor Technology,
Inc.480-786-7653debi.polo@amkor.comReader Contact:Curtis
ZwengerAmkor Technology,
Inc.480-786-7551curtis.zwenger@amkor.com
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