Advantest to Exhibit at IMAPS 2014, San Diego, CA, October 14-16
October 10 2014 - 11:14AM
Business Wire
Company to Showcase its NEW Non-contact,
Non-destructive, TS9000 Mold Thickness Analysis Solutions
Leading semiconductor test equipment supplier Advantest
Corporation (TSE: 6857, NYSE: ATE) will promote its new TS9000 mold
thickness analysis solutions at the International Microelectronics
Assembly and Packaging Society conference in San Diego, October
13-16, 2014. The TS9000 is an innovative metrology tool that
automates mold overlay thickness analysis for IC packaging by using
non-destructive pulsed terahertz radiation. The TS9000 is part of
the company’s family of compact and multipurpose terahertz
spectroscopic / imaging systems.
The TS9000 sets a new standard in the semiconductor industry
with its ability to perform mold thickness analysis of IC
packaging, previously difficult to measure using conventional
metrology. This “first-in-class” system enables rapid, repeatable
and highly accurate measurements, even when analyzing the optically
opaque mold polymer materials typically employed in IC packages.
The flexible system handles die in strip or singulated units and is
also fully compatible with industry-standard JEDEC trays.
Non-contact and non-destructive, it can be configured for partial
or 100% inspection of the product.
IMAPS is the largest society dedicated to the advancement and
growth of microelectronics and electronics packaging technologies
through professional education. The conference will be held from
October 13-16, 2014 at the Town and Country Resort and Conference
Center in San Diego, CA. More information on IMAPS can be found at:
http://www.imaps.org/imaps2014/index.htm
About Advantest Corporation
A world-class technology company, Advantest is a leading
producer of automatic test equipment (ATE) for the semiconductor
industry and a premier manufacturer of measuring instruments used
in the design and production of electronic instruments and systems.
Its leading-edge systems and products are integrated into the most
advanced semiconductor production lines in the world. The company
also focuses on R&D for emerging markets that benefit from
advancements in nanotech and terahertz technologies, and has
introduced multi-vision metrology scanning electron microscopes
essential to photomask manufacturing, as well as a groundbreaking
3D imaging and analysis tools. Founded in Tokyo in 1954, Advantest
established its first subsidiary in 1982, in the USA, and now has
subsidiaries worldwide. More information is available at
www.advantest.com.
Advantest CorporationAmy Gold,
+1-212-710-0515amy.gold@advantest.com
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