.... boosts throughput, cuts test costs for next generation Flash and DRAM memory devices
TOKYO, Nov. 2 /PRNewswire-FirstCall/ -- Advantest Corporation (TSE:6857), (NYSE:ATE), today announced the availability of its new memory test system, the T5383, for multipurpose memory devices such as DRAM, SDRAM, and DDR SDRAM, as well as flash memory and package test of MCP and other devices.
Following the release of Windows Vista(TM)(1), multipurpose memory chips such as DRAM are predicted to enjoy continued strong growth, with sales of personal computers adding to the increased demand generated by the consumer electronics sector. Yet as competition has intensified in the marketplace for cellular phones, digital cameras, and other products, spurring product diversification and forcing prices down, makers of DRAM and flash memory devices have been required to keep pace: while device speed and memory capacity grow, prices drop. This diversification of applications has also boosted demand for MCP (multi-chip package) type memory devices. In this market environment, automatic test equipment must contribute by offering lower test costs. Additionally, MCP manufacturers have begun to seek KGD (known good die) testing at wafer level.
Advantest's new T5383 shares the compact floor space requirements of the company's previous model, the T5377S, but offers a 50% higher parallel test capacity of 384 devices and performs twice as fast, with a maximum test speed of 286MHz / 572Mbps in DDR mode. The new system also offers high speeds and high throughput on at-speed test and KGD test for DRAM wafers, as well as flash memory package test.
Other developments of note include a 200% improvement over the previous model in the speed of the redundancy analysis and repair hardware (the MRA4ev3 option), which is widely used in DRAM front-end test. Calibration time has also been reduced by 90% -- further contributing to reduced test cost.
The T5383's newly developed proprietary wafer motherboard incorporates a new docking mechanism which helps to prevent probe card warpage, a problem that results from temperature changes and impacts semiconductor manufacturing productivity. These advances will completely eliminate the otherwise inevitable 1-2 hour wait subsequent to probe card insertion, and will allow testing to commence immediately.
Key Specifications
Parallel Test Capacity: max. 384 devices
Maximum Test Speed: 286MHz / 572Mbps (in DDR mode)
Test Head: 1 station (1) Windows Vista(TM) is a trademark of Microsoft Corporation in the USA, Japan, and all other registered territories.
About Advantest Advantest Corporation is the world's leading automatic test equipment supplier to the semiconductor industry, and also produces electronic and optoelectronic instruments and systems. A global company, Advantest has long offered total ATE solutions, and serves the industry in every component of semiconductor test: tester, handler, mechanical and electrical interfaces, and software. Its logic, memory, mixed-signal and RF testers and device handlers are integrated into the most advanced semiconductor production lines in the world. Founded in Tokyo in 1954, Advantest established its first subsidiary in 1982, in the USA, and now has 43 subsidiaries worldwide. Among them, Advantest America, Inc. is based in Santa Clara, CA., and Advantest (Europe) GmBH is based in Munich, Germany. More information is available at http://www.advantest.co.jp/ DATASOURCE: Advantest Corporation CONTACT: Amy Gold of Advantest America, Inc., +1-212-850-6670, or Web site: http://www.advantest.com/
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