PITTSBURGH, Jan. 13, 2015 /PRNewswire/ -- ANSYS (NASDAQ:
ANSS) announced today that Fujitsu Limited is using its power noise
and reliability solutions to create three-dimensional integrated
circuits to meet performance requirements for next-generation
high-performance central processing units.
These chips leverage three-dimensional integrated circuit
(3D-IC) architecture to gain power, performance and price
advantages, but the configuration increases the design complexity
and the challenges associated with power and thermal management.
ANSYS® RedHawk™ and ANSYS® Sentinel™ provide
Fujitsu with the ability to perform IR (voltage) drop,
electromigration (EM) and thermal reliability analysis of its large
processor designs by delivering full-chip capacity, fast turnaround
time and production-proven sign-off accuracy.
Finding the optimal floor plan for 3D-IC requires placement of
through-silicon-via (TSV), as well as the power/ground network.
This added complexity necessitates early-stage floor planning,
analysis and debugging, as power and thermal issues become
difficult to resolve later in the design process. Using RedHawk,
Fujitsu can explore various TSV placement options to meet chips'
power noise and reliability requirements.
"The use of 3D-IC architecture adds complexity that needs to be
addressed early in the design process," said Tatsumi Nakada, Director, Next Generation LSI
Packaging Development Office at Fujitsu Limited. "By using RedHawk
and Sentinel, we are able to optimize our design to meet power,
performance and chip cost targets."
"Industry-leading companies such as Fujitsu need to continuously
push the envelope to meet their customers' needs," said Fares
Mubarak, ANSYS vice president and general manager. "ANSYS is
committed to delivering best-in-class solutions that address our
customers' growing power noise and reliability challenges."
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex
design challenges through fast, accurate and reliable engineering
simulation. Our technology enables organizations ― no matter their
industry ― to predict with confidence that their products will
thrive in the real world. Customers trust our software to help
ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs over 2700 professionals,
many of them expert in engineering fields such as finite element
analysis, computational fluid dynamics, electronics and
electromagnetics, embedded software, system simulation and design
optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS also has a strong presence on the major social
channels. To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
ANSS-C
Contact
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Media
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Tom Smithyman
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724.820.4340
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tom.smithyman@ansys.com
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Investors
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Annette Arribas, CTP
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724.820.3700
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.