PITTSBURGH and SANTA CLARA, Calif., Jan. 29, 2014 /PRNewswire/ -- Designing and
optimizing complex high-speed electronic devices from end-to-end is
faster, easier and more accurate thanks to an expanded suite and
new functionality for ANSYS® (NASDAQ: ANSS) SIwave™.
ANSYS' electromagnetic (EM) simulation suite for the design
of high-speed printed circuit boards (PCB) and integrated circuit
(IC) packages is now available via three targeted products,
SIwave-DC, SIwave-PI, and SIwave. Users can quickly identify
potential power and signal integrity problems with increased
flexibility and easier access to a complete set of analysis
capabilities that can be leveraged throughout the PCB design
flow.
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Powered by its hybrid, full-wave finite element EM solver
engine, the new SIwave suite delivers a complete signal integrity
analysis solution in a single user interface. SIwave-DC targets the
DC analysis of low-voltage, high-current PCB and IC packages,
enabling the assessment of critical end-to-end voltage margins for
reliable power delivery. SIwave-PI includes all SIwave-DC features
and adds alternating current (AC) analysis to accurately model
power delivery networks and noise propagation on PCBs. SIwave
combines all SIwave-DC and SIwave-PI functionality and adds a
robust time-domain circuit simulation engine for end-to-end signal
integrity design and compliance.
"It's becoming increasingly important for our customers to be
able to quickly recognize potential pre- and post-layout power and
signal integrity problems for today's high-speed digital designs,"
said Steven Pytel, product manager
at ANSYS. "In consultation with our customers, we identified demand
for targeted analysis for DC, power integrity, and full systems.
The new SIwave technology and workflow provides a complete set of
analysis software based on the highest fidelity electromagnetic
numerical analyses to address all aspects of PCB and IC package
design."
ANSYS SIwave highlights include:
- New Application-Specific Product Offerings
- SIwave-DC allows users to perform pre- and post-layout DC
voltage drop, DC current density and DC power density analyses.
This will ensure that power distribution networks (PDNs) can source
the proper power to integrated circuits by checking that the PDN
has the proper bump, ball and pin sizes as well as proper copper
weighting to minimize losses and identify areas of excess current
resulting in thermal hot spots to reduce risk of field
failure.
- Using sophisticated genetic algorithms, SIwave-PI allows the
specification of various constraints (capacitor price, total number
of capacitors, desired network impedance, etc.) for consideration
in its cost function. Accurate frequency-dependent S-parameter
capacitor models are utilized during simulation. In addition, the
impact of capacitor physical location and mounting technique is
captured by the full-wave electromagnetic extraction engine.
SIwave-PI significantly improves engineering productivity by
automating decoupling capacitor selection, placement and
optimization for printed circuit boards and IC packages.
- With SIwave, signal integrity engineers can easily import
electrical CAD geometry, extract GHz-accurate interconnect models
for the IC, package and PCB, include transistor level models of
drivers and receivers and run signal sign off analysis, impedance
matching and power delivery system optimization. This solution
includes common Input/Output Buffer Information Specification
(IBIS) analyses such as "Power-Aware IBIS" and "IBIS-AMI" to
provide virtual compliance to design engineers.
Other key features in SIwave include virtual compliance,
advanced simulation performance and high-performance computing
(HPC) acceleration and bi-directional links to ANSYS®
Icepak® and ANSYS® Mechanical™ to predict
temperature rise, thermal induced stress and structural
integrity.
The new release will ship in March 2014. To learn more
about the new SIwave, please visit:
http://www.ansys.com/Products/Simulation+Technology/Electromagnetics/Signal+Integrity/ANSYS+SIwave.
About ANSYS, Inc.
ANSYS brings clarity and insight to
customers' most complex design challenges through fast, accurate
and reliable engineering simulation. Our technology enables
organizations ― no matter their industry ― to predict with
confidence that their products will thrive in the real world.
Customers trust our software to help ensure product integrity and
drive business success through innovation. Founded in 1970, ANSYS
employs more than 2,500 professionals, many of them expert in
engineering fields such as finite element analysis, computational
fluid dynamics, electronics and electromagnetics, and design
optimization. Headquartered south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS also has a strong presence on the major social
channels. To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other countries.
All other brand, product, service and feature names or
trademarks are the property of their respective owners.
ANSS-T
Contact Media
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724.514.3053
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Investors
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Annette Arribas,
CTP
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724.514.1782
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Annette.arribas@ansys.com
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SOURCE ANSYS, Inc.