PITTSBURGH, Sept. 17, 2015 /PRNewswire/ -- Customers of
TSMC and ANSYS (NASDAQ: ANSS) can innovate the next generation of
electronic devices – from smartphones to wearable technologies –
thanks to TSMC's certification of ANSYS solutions. This
certification enables customers to deliver their innovative
products to market even faster while minimizing design costs and
risk.
Today's modern electronic products are driven by markets that
demand minimal power as well as high-performance and reliability.
This is commonly achieved by integrating multiple functions into
one system on a chip (SoC). Designing a SoC has become increasingly
time consuming and resource intensive as semiconductor technology
continues to miniaturize. The TSMC certification ensures the
required accuracy and proven design process for customers and
significantly minimizes risk in SoC design, allowing innovative new
devices to be more affordable for consumers.
TSMC's certification of ANSYS®
RedHawk™ and Totem™ solutions for its 10nm FinFET chip enables
designers to address the power integrity and reliability
requirements for chip applications. The certification is based on
the most current version of TSMC's 10nm semiconductor version 0.9
process technology. TSMC's certification and reference flow
provides static and dynamic voltage drop analysis and advanced
signal and power electromigration verification to meet TSMC's 10nm
requirements – enabling users to innovate the next generation of
SoC designs for use in emerging mobile, computing and networking
applications.
"The joint delivery of reference flow and the certification of
RedHawk and Totem for TSMC 10nm FinFET technology enable our mutual
customers to design complex SoCs with built-in reliability," said
John Lee, general manager, ANSYS.
"Our long and successful track record of technical alliance with
TSMC is continuing to drive the creation and delivery of advanced
power integrity and reliability solutions that adequately and
accurately address the needs of TSMC's emerging silicon technology,
enabling customers to innovate at the design level."
"We have closely collaborated with ANSYS to enable the delivery
of advanced power integrity solutions including the analysis of
thermal effects in 10nm FinFET technology," said Suk Lee, TSMC senior director, design
infrastructure marketing division. "The certification of RedHawk
and Totem for 10nm FinFET technology ensures tool readiness, and
allows customers to analyze and design power delivery networks with
confidence."
The ANSYS portfolio of product offerings will be showcased at
TSMC OIP Ecosystem Forum on Sept.
17 in Santa Clara,
California.
About ANSYS, Inc.
ANSYS brings clarity and insight to customers' most complex
design challenges through fast, accurate and reliable engineering
simulation. Our technology enables organizations ― no matter their
industry ― to predict with confidence that their products will
thrive in the real world. Customers trust our software to help
ensure product integrity and drive business success through
innovation. Founded in 1970, ANSYS employs over 2,750
professionals, many of them expert in engineering fields such as
finite element analysis, computational fluid dynamics, electronics
and electromagnetics, and design optimization. Headquartered south
of Pittsburgh, U.S.A., ANSYS has more than 75 strategic sales
locations throughout the world with a network of channel partners
in 40+ countries. Visit www.ansys.com for more information.
ANSYS also has a strong presence on the major social channels.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
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Contact
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Media
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Amy
Pietzak
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724.820.4367
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amy.pietzak@ansys.com
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Investors
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Annette Arribas,
CPT
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724.514.1782
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.