PITTSBURGH, March 15, 2016 /PRNewswire/ -- Manufacturers
of advanced electronic products – ranging from mobile and
networking appliances to futuristic Internet of Things devices –
will become more powerful, smaller and more energy efficient thanks
to new advances from TSMC and ANSYS (NASDAQ: ANSS).
TSMC's certification of ANSYS solutions for its 10nm FinFET
process technology, enables customers to deliver their innovative
and reliable products to market faster while minimizing design
costs and risk. TSMC also certified ANSYS solutions for the latest
7nm design rule manual and SPICE model for early design starts.
Additionally, ANSYS solutions are enabled for TSMC's Integrated
Fanout (InFO), the advanced wafer-level packaging technology for
three-dimensional integrated circuits.
Today's cutting-edge electronic products demand minimal power
yet still be reliable under a variety of conditions while still
being affordable. These requirements place demands on the chip as
well as a package, board and system. The TSMC certification
provides users with a proven design process for advanced System on
a Chip (SoC) – making new and innovative devices more affordable
for consumers.
ANSYS design solutions support TSMC's InFO technology to provide
cost-effective scaling to increase system bandwidth, reduced power
consumption and smaller form factors while shortening overall
design turnaround time. Compared to other methodologies, InFO is an
ideal solution for mobile and IoT applications.
TSMC's certification of ANSYS solutions for its advanced FinFET
process technologies enables designers to address the power
integrity and reliability requirements for any given chip.
Customers will have the power to perform the most accurate static
and dynamic voltage drop analysis and advanced signal and power
electromigration verification. This empowers users to innovate the
next generation of SoC designs for use in mobile, computing and
networking applications.
"Certification of ANSYS solutions for TSMC's latest technology
gives our mutual customers a competitive advantage when designing
complex SoCs," said John Lee,
general manager, ANSYS. "In addition, we're working with TSMC to
expand our existing solution scope to support InFO technology,
driving the delivery of advanced power integrity and reliability
solutions across package, board and system levels, enabling
customers to innovate at the chip-package-system levels."
"Our close collaboration with ANSYS has enabled the delivery of
advanced power integrity solutions including the analysis of
thermal effects in FinFET technologies," said Suk Lee, senior director, design infrastructure
marketing division at TSMC. "The certification for 10nm and 7nm,
and the enablement of multiple ANSYS solutions for TSMC's InFO
packaging, ensures tool readiness for advanced FinFET technologies
and allows customers to analyze and design power delivery networks
for 3D-ICs with confidence."
About ANSYS, Inc.
ANSYS is the global leader in engineering simulation. We bring
clarity and insight to our customer's most complex design
challenges through the broadest portfolio of fast, accurate
and reliable simulation tools. Our technology enables organizations
in all industries to imagine high-quality, innovative and
sustainable product designs that have an accelerated time to
market. Founded in 1970, ANSYS employs almost
3000 professionals, more than 700 of them with PhDs in
engineering fields such as finite element analysis, computational
fluid dynamics, electronics and electromagnetics, embedded
software, system simulation and design optimization. Headquartered
south of Pittsburgh, U.S.A., ANSYS has more than 75 strategic
sales and development locations throughout the world with
a network of channel partners in 40+ countries. Visit www.ansys.com
for more information.
ANSYS also has a strong presence on the major social channels.
To join the simulation conversation, please visit:
www.ansys.com/Social@ANSYS
ANSYS and any and all ANSYS, Inc. brand, product, service and
feature names, logos and slogans are registered trademarks or
trademarks of ANSYS, Inc. or its subsidiaries in the United States or other
countries. All other brand, product, service and
feature names or trademarks are the property of their respective
owners.
ANSS-T
Contact
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Media
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Amy
Pietzak
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724.820.4367
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amy.pietzak@ansys.com
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Investors
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Annette Arribas,
CTP
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724.820.3700
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annette.arribas@ansys.com
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SOURCE ANSYS, Inc.