3D ICs will resolve the memory bottleneck that current
technologies will face in the near future, finds Frost &
Sullivan's TechVision team
LONDON, Feb. 28, 2017 /PRNewswire/ -- With 2D integrated
circuit (IC) technology nearing its scaling limit, there is an
urgent need to scale up vertically to cope with the breakneck pace
of advances in digital technologies. However, the progress made by
the digital components has not been matched by the advances in
microelectronic components, which has resulted in hindrances such
as Memory Wall. In this scenario, 3D IC technology's
ability to help create high-performing, low-power-consuming
microchips is proving invaluable.
The rising relevance of the Mega Trends of Internet of
Things (IoT) and miniaturisation has made 3D ICs
integral to modern-day electronic devices, as they enable:
- enhanced storage capability
- low power consumption
- efficient thermal management
- high-speed data transmission and processing
- high brightness lighting
- connected and smart devices
Future Opportunities for 3D Integrated Circuits is a
recent analysis from Frost & Sullivan's
TechVision (Microelectronics) Growth
Partnership Service program. The research covers major application
areas for 3D ICs, including consumer electronics, ICT, automobiles,
military, healthcare, aerospace, datacenters, gaming, biomedical
devices, military equipment and wearable devices.
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These capabilities have thrown open the application sectors of
memory, microelectromechanical systems (MEMS)
and sensors. They have also been a driving force in the
emerging technologies of microfluidics and silicon
photonics.
"3D ICs help shorten interconnect length as well as
enhance signal speed while dissipating very little power," noted
Frost & Sullivan TechVision Research Analyst Brinda Manivannan. "The technological
superiority of 3D ICs addresses the needs of the futuristic
semiconductor industry by aiding in the development of high-density
and multifunctional electronic components."
While the advantages of 3D IC are many, manufacturers often have
to overcome high development costs, technical limitations, wide
prevalence of existing technologies and a highly unstructured
supply chain. To combat these challenges, 3D IC companies have to
find niche markets and streamline their supply chain
horizontally to establish clear technological leadership.
"There has been significant interest among microelectronic
companies all over the world in exploring 3D IC technology,"
noted Manivannan. "Among regions, Asia-Pacific is witnessing the most heated
R&D activity and among countries, the U.S. is at the top of the
R&D leaderboard, followed by China. While U.S. R&D efforts are aimed at
technology development, Asia-Pacific countries are mostly looking to
scale the technology."
About TechVision
Frost & Sullivan's global
TechVision practice is focused on innovation, disruption and
convergence, and provides a variety of technology-based alerts,
newsletters and research services as well as growth consulting
services. Its premier offering, the TechVision program, identifies
and evaluates the most valuable emerging and disruptive
technologies enabling products with near-term potential. A unique
feature of the TechVision program is an annual selection of 50
technologies that can generate convergence scenarios, possibly
disrupt the innovation landscape, and drive transformational
growth. View a summary of our TechVision program by clicking on the
following link: http://ifrost.frost.com/TechVision_Demo.
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