SanDisk Announces World’s First 256 Gigabit 3-bit-per-cell (X3) 48-layer 3D NAND Chip; Operations Begin for 3D NAND Pilot L...
August 03 2015 - 5:00PM
Business Wire
SanDisk Corporation (NASDAQ: SNDK), a global leader in flash
storage solutions, announced today its 256 Gigabit (Gb)
3-bit-per-cell (X3) 48-layer 3D NAND chip and the start of 3D NAND
pilot line operations in Yokkaichi, Japan in conjunction with its
partner, Toshiba.
“We are pleased to announce our first 3D NAND chip targeted for
production,” said Dr. Siva Sivaram, executive vice president,
memory technology, SanDisk. “This is the world’s first 256 Gb X3
chip, developed using our industry-leading 48-layer BiCS
technology1 and demonstrating SanDisk’s continued leadership in X3
technology. We will use this chip to deliver compelling storage
solutions for our customers.”
BiCS is a nonvolatile memory architecture designed to bring new
levels of density, scalability and performance to flash-based
devices. BiCS NAND memory will also provide enhanced write/erase
endurance, write speeds and energy efficiency relative to
conventional 2D NAND.
SanDisk’s 256 Gb X3 BiCS chip is designed for wide applicability
in consumer, client, mobile and enterprise products, and is
expected to begin shipping in SanDisk’s products in 2016.
About SanDisk
SanDisk Corporation (NASDAQ: SNDK), a Fortune 500 and S&P
500 company, is a global leader in flash storage solutions. For
more than 27 years, SanDisk has expanded the possibilities of
storage, providing trusted and innovative products that have
transformed the electronics industry. Today, SanDisk’s quality,
state-of-the-art solutions are at the heart of many of the world's
largest data centers, and embedded in advanced smartphones, tablets
and PCs. SanDisk’s consumer products are available at hundreds of
thousands of retail stores worldwide. For more information, visit
www.sandisk.com.
©2015 SanDisk Corporation. All rights reserved. SanDisk and the
SanDisk logo are trademarks of SanDisk Corporation, registered in
the U.S. and other countries.
1 – SanDisk survey, as of August 3, 2015.
This news release contains certain forward-looking statements,
including expectations for 3D NAND technology, including its
development, production timing, expected timing for shipment of
SanDisk products to begin in 2016, capabilities, performance
improvements and anticipated product applications that are based on
our current expectations and involve numerous risks and
uncertainties that may cause these forward-looking statements to be
inaccurate. Risks that may cause these forward-looking statements
to be inaccurate include among others: our 3D NAND technology or
our solutions and products utilizing this new technology may not be
available when we expect and shipment may not commence when
expected; our 3D NAND technology may not perform as expected; we
may experience difficulties or delays in developing, producing or
ramping with acceptable yields our 3D NAND technology in the
timeline we expect, including as a result of supply chain
difficulties or delays, or failure to manage risks associated with
our ventures and strategic partnerships with Toshiba, or the other
risks detailed from time-to-time in our Securities and Exchange
Commission filings and reports, including, but not limited to, our
most recent quarterly report on Form 10-Q and our annual report on
Form 10-K. We do not intend to update the information contained in
this news release.
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version on businesswire.com: http://www.businesswire.com/news/home/20150803006337/en/
Media Contact:SanDisk CorporationMichael Diamond,
408-801-1108michael.diamond@sandisk.comorInvestor
Relations:SanDisk CorporationJay Iyer,
408-801-2067jay.iyer@sandisk.com
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