SanDisk Announces 48 Layer 3D NAND
March 25 2015 - 10:00PM
Business Wire
On track to commence pilot production in the
second half of 2015
SanDisk Corporation (NASDAQ:SNDK), a global leader in flash
storage solutions, today announced that it has successfully
developed its 48 layer second generation 3D NAND, also referred to
as BiCS2. Pilot production will commence as planned in the second
half of 2015 in the Yokkaichi joint venture facility, with
meaningful commercial production targeted for 2016.
“We are very pleased to announce our second generation 3D NAND,
which is a 48 layer architecture developed with our partner
Toshiba,” said Dr. Siva Sivaram, executive vice president, memory
technology, SanDisk. “We utilized our first generation 3D NAND
technology as a learning vehicle, enabling us to develop our
commercial second generation 3D NAND, which we believe will deliver
compelling storage solutions for our customers.”
SanDisk plans to use the second generation 3D NAND technology
across a broad range of solutions, from removable products to
enterprise SSDs.
About SanDisk
SanDisk Corporation (NASDAQ: SNDK), a Fortune 500 and S&P
500 company, is a global leader in flash storage solutions. For
more than 25 years, SanDisk has expanded the possibilities of
storage, providing trusted and innovative products that have
transformed the electronics industry. Today, SanDisk’s quality,
state-of-the-art solutions are at the heart of many of the world's
largest data centers, and embedded in advanced smart phones,
tablets and PCs. SanDisk’s consumer products are available at
hundreds of thousands of retail stores worldwide. For more
information, visit www.sandisk.com.
© 2015 SanDisk Corporation. All rights reserved. SanDisk and the
SanDisk logo are trademarks of SanDisk Corporation, registered in
the United States and other countries. Other brand names mentioned
herein are for identification purposes only and may be the
trademarks of their respective holder(s).
This news release contains certain forward-looking statements,
including expectations for 3D NAND technology, including its
development, production and timing and location thereof,
capabilities, performance and use, that are based on our current
expectations and involve numerous risks and uncertainties that may
cause these forward-looking statements to be inaccurate. Risks that
may cause these forward-looking statements to be inaccurate include
among others: our 3D NAND technology or our solutions utilizing
this new technology may not be available when we expect or perform
as expected; we may experience difficulties or delays in
developing, producing or ramping with acceptable yields 3D NAND
technology, including as a result of construction difficulties or
delays or failure to manage other risks associated with our
ventures and strategic partnerships with Toshiba; or the other
risks detailed from time-to-time in our Securities and Exchange
Commission filings and reports, including, but not limited to, our
most recent annual report on Form 10-K. We do not intend to update
the information contained in this news release.
Media Contact:Michael Diamond,
408-801-1108michael.diamond@sandisk.comInvestor Contacts:Jay
Iyer, 408-801-2067jay.iyer@sandisk.comorBrendan Lahiff,
408-801-1732brendan.lahiff@sandisk.com
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