- Industry’s first integrated Laser and
Silicon Photonic Integrated Circuit leveraging Etched Facet
Technology (EFT)
- Production ready chipset delivers the
requisite economics to drive the transition from 100G to 400G in
data centers
- Offers customers improved performance,
eliminates the need for assembly of discrete components, reduces
configuration and test costs, and accelerates time to market
- Live demonstration at OFC 2017
showcasing PAM-4 100G Single Lambda capability
MACOM Technology Solutions Inc. (“MACOM”), today announced the
production ready MAOP-L284CN, MACOM’s 100G CWDM4 transmitter
L-PICTM (Lasers integrated with a Silicon Photonic Integrated
Circuit) and supporting driver and controller IC chipset.
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Industry’s first integrated Laser and
Silicon Photonic Integrated Circuit leveraging Etched Facet
Technology (EFT) (Photo: Business Wire)
To meet the bandwidth demands, resiliency and data redundancy
requirements of today’s Cloud Data Centers, data center optical
interconnects are transitioning from 100G to 400G, driving
explosive demand for high-speed optical links.
MACOM’s demonstration shows the platform’s PAM-4 CWDM4
capability of uncooled operation at 400G at distances up to two
kilometers on single mode fiber. These devices leverage key MACOM
technologies optimized for high port density applications in Cloud
Data Center applications. The demonstration will transmit 100G
PAM-4 over a single lambda with the L-PIC platform at OFC 2017.
“We have moved quickly to leverage the proven success achieved
with EFT lasers to other platforms. Using EFT, we enabled the
seamless integration of the TOSA optical path including lasers,
monitor diodes, modulators and multiplexers onto a single chip,
yielding the industry’s first silicon photonic integrated circuit
(PIC) integrated with self-aligning lasers (L-PIC) for 100G,” said
Arlen Martin, Director of Product Marketing, Silicon PICs,
Lightwave Networking Components, at MACOM. “By solving the key
challenge of aligning lasers to the silicon PIC, maintaining high
yield and high coupling efficiency, MACOM is making the adoption of
silicon PICs a reality for the high-speed, high density optical
interconnects demanded by Cloud Data Centers OEMs.”
MACOM’s L-PIC device combines four high-performance distributed
feedback (DFB) laser diodes using MACOM’s patented Etched Facet
Technology (EFT), four 28G Mach-Zehnder optical modulators
integrated with a coarse wavelength division multiplexer, monitor
photodiodes and a high-performance output coupler for operation on
one standard single mode fiber. Using MACOM’s patented
self-aligning etched facet technology (SAEFTTM) for precision
attachment of the lasers to the SiPh L-PIC, this device enables
customers to bypass optimizing optical coupling with active
alignment and curing, offering instead an integrated single device
that reduces manufacturer assembly time and component cost.
The MAOP-L284CN L-PIC transmitter is available as part of a
complete MACOM chipset platform, including the MAMF-011095 silicon
PIC controller and the MASC-37053A high-speed, low-power modulator
driver. Optimized to work together, this chipset solution offers
customers improved performance, eliminates the need for assembly of
discrete components, reduces configuration and test costs, and
accelerates time to market. With the recent acquisition of
AppliedMicro and their PAM-4 technology, MACOM is extending the
L-PIC transmitter platform to support 200G and 400G switch-to-fiber
applications.
MACOM will feature demonstrations of its L-PIC based CWDM4
chipset solution and 100G over a PAM-4 single lambda on the L-PIC
platform at OFC 2017, Booth #1736, March 19th-23rd in Los Angeles,
CA. To make an appointment, contact your local sales
representative. For more information on MACOM’s broad optical and
photonic portfolio visit: www.macom.com.
ABOUT MACOM:
MACOM is a new breed of analog semiconductor company — one that
delivers a unique combination of high growth, diversification and
high profitability. We are enabling a better-connected and safer
world by delivering breakthrough semiconductor technologies for
optical, wireless and satellite networks that satisfy society’s
insatiable demand for information.
Today, MACOM powers the infrastructure that millions of lives
and livelihoods depend on every minute to communicate, transact
business, travel, stay informed and be entertained. Our technology
increases the speed and coverage of the mobile Internet and enables
fiber optic networks to carry previously unimaginable volumes of
traffic to businesses, homes and Data Centers.
Keeping us all safe, MACOM technology enables next-generation
radars for air traffic control and weather forecasting, as well as
mission success on the modern networked battlefield.
MACOM is the partner of choice to the world’s leading
communications infrastructure and aerospace and defense companies,
helping solve their most complex challenges in areas including
network capacity, signal coverage, energy efficiency, and field
reliability, through its best-in-class team and broad portfolio of
RF, microwave, millimeterwave and lightwave semiconductor
products.
MACOM is a pillar of the semiconductor industry, thriving for
more than 60 years of daring to change the world for the better
through bold technological strokes that deliver true competitive
advantage to customers and superior value to investors.
Headquartered in Lowell, Massachusetts, MACOM is certified to
the ISO9001 international quality standard and ISO14001
environmental management standard. MACOM has design centers and
sales offices throughout North America, Europe, Asia and
Australia.
MACOM, M/A-COM, M/A-COM Technology Solutions, M/A-COM Tech,
Partners in RF & Microwave, The First Name in Microwave and
related logos are trademarks of MACOM. All other trademarks are the
property of their respective owners.
For more information about MACOM, please visit www.macom.com,
follow @MACOMtweets on Twitter, join MACOM on LinkedIn, or visit
the MACOM YouTube Channel.
DISCLAIMER FOR NEW PRODUCTS:Any express or implied
statements in MACOM product announcements are not meant as
warranties or warrantable specifications of any kind. The only
warranty MACOM may offer with respect to any product sale is one
contained in a written purchase agreement between MACOM and the
purchaser concerning such sale and signed by a duly authorized
MACOM employee, or, to the extent MACOM's purchase order
acknowledgment so indicates, the limited warranty contained in
MACOM's standard Terms and Conditions for Quotation or Sale, a copy
of which may be found at: www.macom.com/support.
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MACOM SALES INFORMATION, PLEASE CONTACT:North Americas --
Phone: 800.366.2266Europe -- Phone: +353.21.244.6400India -- Phone:
+91.80.43537383China – Phone: +86.21.2407.1588orMACOM MEDIA
CONTACTS:MACOM Technology Solutions Inc.Ozzie Billimoria,
978-656-2896ozzie.billimoria@macom.comorRainier CommunicationsColin
Boroski, 508-475-0025 x142cboroski@rainierco.comorembedded
PRAnja-Maria Hastenrath, +49 (0)89 64913634-11ah@embedded-pr.de
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