MILPITAS, Calif., April 16, 2015 /PRNewswire/ -- Today,
KLA-Tencor Corporation (NASDAQ: KLAC) announced two new systems
that support advanced semiconductor packaging technologies:
CIRCL-AP™ and ICOS® T830. Designed for characterization
and monitoring of the diverse processes used in wafer-level
packaging, CIRCL-AP enables all-surface wafer defect inspection,
review and metrology at high throughput. The ICOS T830 provides
fully automated optical inspection of integrated circuit (IC)
packages, leveraging high sensitivity with 2D and 3D measurements
to determine final package quality for a wide range of device types
and sizes. Both systems help IC manufacturers and outsourced
semiconductor assembly and test (OSAT) facilities address
challenges, such as finer feature sizes and tighter pitch
requirements, as they adopt innovative packaging techniques.
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"Consumer mobile electronics continue to drive production of
smaller, faster and more powerful devices," stated Brian Trafas, chief marketing officer of
KLA-Tencor. "Advanced packaging technologies offer device
performance advantages, such as increased bandwidth and improved
energy efficiency. The packaging production methods, however, are
more complex—involving the implementation of typical front-end IC
manufacturing processes, such as chemical mechanical planarization
and high aspect ratio etch, and unique processes, such as temporary
bonding and wafer reconstitution. By combining our expertise in
front-end semiconductor manufacturing process control with
experience gained through collaborations at key R&D sites and
industry consortia, we have developed flexible and efficient
inspection solutions that can help address packaging challenges
from wafer-level to final component."
The CIRCL-AP includes multiple modules that utilize parallel
data collection for fast, cost-efficient process control of
advanced wafer-level packaging processes. It supports a range of
packaging technologies, including wafer-level chip scale packaging,
fan-out wafer-level packaging and 2.5D/3D IC integration using
through silicon vias (TSVs). The industry-proven 8-Series serves as
the CIRCL-AP's front side defect inspection and metrology module,
which couples LED scanning technology with automated defect binning
to reduce nuisance and speed detection of critical packaging
defects, such as TSV cracks and redistribution layer shorts. The
CV350i module, based on KLA-Tencor's VisEdge®
technology, enables leading detection, binning and automated review
of wafer edge defects and metrology for critical edge trim and
bonding steps in the TSV process flow. With multiple imaging and
illumination modes, the Micro300 module can produce high precision
2D and 3D metrology for bump, redistribution and TSV processes.
Utilizing a flexible architecture, the CIRCL-AP can be configured
with one or more modules to address the requirements of specific
packaging applications, while the handler supports bonded, thinned
and warped substrates.
The ICOS T830 extends the industry-leading ICOS component
inspection series to address yield challenges associated with
advanced packaging types, including lead frame, fan-out
wafer-level, flip-chip and stacked packages. Enhanced package
visual inspection capability, xPVI™, enables high sensitivity
detection of top and bottom component surface defects, such as
voids, scratches, pits, chips and exposed wires. To ensure quality
standards are being met for leading-edge memory and logic packaged
devices, the ICOS T830 offers high speed 3D ball, lead and
capacitor metrology, package z-height measurement and component
side inspection. The xCrack+ inspection station enables accurate
detection of micro-crack defects—a key failure mechanism of thinner
components used in mobile applications. The ICOS T830 incorporates
high-throughput operation of four independent inspection stations
and high-speed sorting of the inspected packaged components to
achieve cost-effective component quality control.
Multiple CIRCL-AP systems in various configurations have been
installed worldwide for use in development and production of TSV,
fan-out wafer-level packaging and other wafer-level packaging
technologies. ICOS T830 systems are in use at many worldwide IC
packaging facilities, providing accurate feedback on package
quality across a range of device types and sizes. To maintain the
high performance and productivity demanded by semiconductor
packaging providers, the CIRCL-AP and ICOS T830 systems are backed
by KLA-Tencor's global, comprehensive service network. More
information on the CIRCL-AP and ICOS T830 can be found on the
packaging process control web page.
About KLA-Tencor:
KLA-Tencor Corporation, a leading provider of process control
and yield management solutions, partners with customers around the
world to develop state-of-the-art inspection and metrology
technologies. These technologies serve the semiconductor, LED and
other related nanoelectronics industries. With a portfolio of
industry-standard products and a team of world-class engineers and
scientists, the company has created superior solutions for its
customers for nearly 40 years. Headquartered in Milpitas, Calif., KLA-Tencor has dedicated
customer operations and service centers around the world.
Additional information may be found at http://www.kla-tencor.com
(KLAC-P).
Forward Looking Statements:
Statements in this press release other than historical facts,
such as statements regarding the expected performance of the
CIRCL-AP and ICOS T830 systems; the extendibility of the CIRCL-AP
and ICOS T830 systems to advanced packaging technologies; trends in
consumer mobile electronics; expected uses of the CIRCL-AP and ICOS
T830 systems by KLA-Tencor's customers; and the anticipated cost,
operational and other benefits realizable by users of the CIRCL-AP
and ICOS T830 systems, are forward-looking statements, and are
subject to the Safe Harbor provisions created by the Private
Securities Litigation Reform Act of 1995. These forward-looking
statements are based on current information and expectations, and
involve a number of risks and uncertainties. Actual results may
differ materially from those projected in such statements due to
various factors, including delays in the adoption of new
technologies (whether due to cost or performance issues or
otherwise), the introduction of competing products by other
companies or unanticipated technological challenges or limitations
that affect the implementation, performance or use of KLA-Tencor's
products.
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SOURCE KLA-Tencor Corporation