Ericsson-backed research project breaks new ground in silicon photonic integration
August 31 2015 - 4:00AM
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New silicon photonics chip increases bandwidth,
reduces cost and enables optical routing in the cloud and 5G
era
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First chip now in testing & characterization
phase
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IRIS project co-funded by European
Commission
The Ericsson-led IRIS project has produced a silicon photonics
switch designed for housing thousands of optical circuits on a
single chip.
The first chip is now in the test and
characterization phase, and if successful the outcome will be major
breakthrough for the industry, paving the way for a new generation
of optical systems integrated in a single device.
Silicon photonics uses
silicon as a miniaturized optical medium for transmitting and
switching data at very high speeds, which reduces power consumption
and footprint and increases capacity, which combined will lead to
lower operational costs.
Co-funded by the European Commission as a Specific Target Research
Project (STREP) under the Seventh Framework Programme for research
and development (FP7), the IRIS project aims to create a
high-capacity and reconfigurable WDM photonic switch using silicon
photonics to monolithically integrate circuits in a single
chip.
Such a chip will enable network operators to
enhance the network performance, increasing node capacity as
required by future 5G networks and Cloud. This can be achieved by
high-scale integration of features, such as high-speed
transmission, switching, and interconnectivity in the same
chip.
The award winning Ericsson Hyperscale Datacenter
System 8000 is an example where silicon photonics technology is
being implemented already. With its optical interconnect, it brings
major benefits to datacenter operators in terms of total cost of
ownership.
Peter Christy, Research Director at 451 Research
says; "Optical interconnection will play a critical role in data
center evolution. Silicon photonics improves the cost and power
efficiency very significantly. The Ericsson cloud initiative
and HDS 8000 are early movers in the commercial exploitation of
silicon photonics in the datacenter, and systems like this clearly
demonstrate the technology's potential."
Researchers from Ericsson in Pisa have generated and filed all the
relevant patent proposals.
The project consortium is led by Ericsson (Italy)
and includes ST Microelectronics (Italy), CEA-LETI (France), CNIT
(Italy), University of Trento (Italy), Universitat Politecnica de
Valencia (Spain), Technische Universitat Wien (Austria) and
Electronics and Telecommunications Research Institute (Republic of
Korea).
For more information about the project, visit
www.ict-iris.eu.
NOTES TO EDITORS
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Ericsson-backed project breaks new
ground in silicon photonic
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