IRVINE, Calif., March 23, 2015 /PRNewswire/ -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced rapid adoption of its latest 40/50/100 Gigabit Ethernet (GbE) PHY in pluggable QSFP+ optical and DAC modules. Multiple original equipment manufacturers (OEMs) and original device manufacturers (ODMs) have adopted the devices for immediate implementation. Broadcom will showcase its latest innovations for high speed interconnects products at the OFC Technical Conference in Los Angeles, California, March 24-26. For more news, visit Broadcom's Newsroom.

To meet rising data traffic demands, network operators are looking for cost and performance improvements in the data center that can leverage legacy cabling. Optimized for use in 40G quad small form-factor pluggable (QSFP) optics and direct attach copper (DAC) applications, the Broadcom PAM4 devices enable transmission rates of 40/50 gigabits per second (Gbps) over the existing infrastructure.

"The rapid adoption and support of our PAM4 technology by our leading customers and partners reinforces Broadcom's leadership in wired physical layer devices," said Lorenzo Longo, Broadcom, Vice President and General Manager, Physical Layer Products. "Our devices are designed to support higher data throughput over existing low bandwidth channels by transmitting more bits per symbol, significantly reducing cost by eliminating the need for expensive interconnect media."

"We are pleased to be working with Broadcom to deliver future-proof technology using their latest PAM4 offering," said Chris Lyon, Amphenol Product Manager. "Using the BCM82004 in a 1X40G PAM4 QSFP implementation, we are able to meet our customers' expectations for excellence, performance and scalability."

"Using Broadcom's new PAM4 technology has enabled us to provide our data center customers with high performance, dependability and more flexibility than ever before," said Arash Behziz, TE System Architecture Group Technologist. "The 40G Direct Attach Copper provides cost savings, reduces infrastructure management issues and positions us for long-term success."

"Broadcom and Molex share a long-term partnership in today's highly competitive communications environment," said Zach Bradford, Molex Manager of New Product Development. "Coupled with our Impel product line, Broadcom's latest PAM4 technology supports high data rate applications and delivers exceptional performance — giving our customers the right tools they need to drive data speed growth."

At OFC 2015, Broadcom and its ecosystem partners will demonstrate:

• 40G PAM4 QSFP Modules over Broadcom^® StrataXGS^® Switch Platform
• 56G PAM4 Over Backplane
• 56G PAM4 Over Optics

Key Features:

• Single 40/50GbE PHY drives 40/56G serial over various media
• Supports a variety of DAC reaches from multiple suppliers
• Enables SMF/MMF optics and silicon photonics
• Low-power 28 nm CMOS design
• Small 7x7mm package fits within QSFP+ form factor, cable assembly and optics modules

Availability

The BCM82040 and BCM82004 are now sampling.

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About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With one of the industry's broadest portfolio of state-of-the-art system-on-a-chip solutions, Broadcom is changing the world by Connecting everything®. For more information, go to www.broadcom.com.

Broadcom^®, the pulse logo, Connecting everything^® and the Connecting everything logo are among the trademarks of Broadcom Corporation and/or its affiliates in the United States, certain other countries and/or the EU. Any other trademarks or trade names mentioned are the property of their respective owners.

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SOURCE Broadcom Corporation; BRCM Infrastructure