IRVINE, Calif., March 18, 2015 /PRNewswire/ --
News Highlights:
- Delivers more than 100 Terabits per second (Tbps) of switching
capacity
- External packet memory provides up to 300 times more traffic
buffering
- Complementary to StrataXGS® Trident and Tomahawk™
families
- Accelerates the transition from ASIC to merchant silicon across
routing and switching markets
Broadcom Corporation (NASDAQ: BRCM), a global innovation leader
in semiconductor solutions for wired and wireless communications,
today announced its next generation addition to the StrataDNX™
("Dune") family of switch system-on-chip (SoC) devices. These new
SoCs have been adopted by top tier equipment makers worldwide and
provide a complete solution for the service provider network
ranging from dense compact switching and routing platforms to
large-scale multi-chassis routers. Broadcom's new switch SoCs are
ideal for optical transport, carrier Ethernet, edge and core
routers, data center cloud and enterprise campus market segments.
For more news, visit Broadcom's Newsroom.
The Broadcom® StrataDNX products are the world's first to
provide 800 Gbps packet processing per device at a high interface
bandwidth while integrating a scalable multi-terabit switch fabric,
hierarchical traffic manager, external packet buffer memory and
advanced packet processing. This unique combination enables
equipment makers to deliver network equipment with a higher port
density, lower power consumption and greater subscriber scale in a
smaller physical system size.
The StrataDNX family of expandable products is complementary to
Broadcom's highly integrated StrataXGS® Trident and Tomahawk™
SoCs. Together they provide the industry's most comprehensive
end-to-end portfolio of switching solutions across the carrier,
data center and enterprise markets.
"With the addition of our latest StrataDNX products to our
switch portfolio, Broadcom is delivering the most comprehensive
switching platform in the industry," said Ram Velaga, Broadcom
Senior Vice President and General Manager, Network Switch. "These
devices will change the way customers build and deploy networking
equipment by providing a unique combination of advanced core
features at a level of high bandwidth integration never before
possible."
The StrataDNX family supports pre-standard implementation for 25
and 50 Gigabit Ethernet, enabling direct connectivity to the
Broadcom BCM56960 Tomahawk switch SoC, the industry's first high-
density 25/100 Gigabit Ethernet switch for cloud-scale
networks. In addition, the devices support port speeds of up
to 400 Gbps, enabling the world's largest interconnect pipes and
roadmap to 400 Gigabit Ethernet. Integrated accelerators for
carrier service management provide visibility and control for
carrier networks and distributed data centers traversing a wide
area network (WAN).
The 28 nanometer (nm) StrataDNX switch family offers the
following device options:
- BCM88370 – A single-chip switch delivering 800 Gbps Ethernet
for compact carrier Ethernet and data center top-of-rack
switches
- BCM88670 – A 720 Gbps packet processor and traffic manager with
DNX fabric interfaces for carrier Ethernet switch router, data
center chassis, and enterprise campus applications
- BCM88770 – A high density switch fabric device providing
3.6Tbps throughput per device enabling over 100Tbps switching
capacity in a single stage system when combined with BCM88670
Broadcom's StrataDNX line delivers a complete set of advanced
features for the most demanding carrier, campus and cloud
environments. The devices support external DRAM-based packet memory
offering up to 300x more traffic buffering compared with on-chip
memory, enabling zero-packet-loss in heavily congested networks.
In-field reconfigurable flexible packet processing engines allow
for customer-specific forwarding paradigms or future support of new
and emerging protocols.
On-chip hierarchical traffic management ensures per-subscriber
bandwidth guarantees, required by carrier networks to deliver on
service level agreements (SLAs). For optical transport
applications, the architecture enables converged carrier Ethernet
and optical transport network (OTN) traffic over a unified fabric,
enabling significant savings in carrier CapEx and OpEx.
The BCM88370, BCM88670 and the BCM88770 combine the
market-leading feature-set of StrataDNX with high bandwidth
capacity, enabling a new generation of innovative network switch
systems. These include converged Ethernet/optical transport
platforms, deep buffered elements for the data center cloud, and
advanced network functions virtualization (NFV) infrastructure
solutions combining the attributes of carrier and data center
network equipment.
StrataDNX Family Key Features
- BCM88370 and BCM88670
- Up to 800 Gbps forwarding capacity per device
- Advanced, flexible and configurable packet processor
- Integrated accelerators for carrier service management
- Carrier feature support including Ethernet OAM, MPLS, VPLS
- Integrated hierarchical traffic manager with support for
thousands of flows
- External packet buffer memory supporting DDR4 or GDDR5
DRAM
- Data center virtual network tunneling including VXLAN, NVGRE
and Geneve
- Support for 10 GE, 25 GE, 40 GE, 50 GE, 100 GE Ethernet port
interfaces
- Support for 200G-400G Interlaken™ port interfaces
- IEEE 1588 network timing engine
- BCM88770
- Chassis switch fabric supporting 3.6 Tbps per device
- Single-stage interconnect for up to 144 BCM88670 devices
- Dual-plane Ethernet/optical switch fabric
- Backwards compatible to legacy DNX switch fabric chipsets
Availability
Broadcom's StrataDNX BCM88370, BCM88670 and BCM88770 devices are
currently sampling.
For ongoing Broadcom news visit our Newsroom, read our
B-Connected Blog, or visit us on Facebook or Twitter. And to stay
connected, subscribe to our RSS Feed.
About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is
a global leader and innovator in semiconductor solutions for wired
and wireless communications. Broadcom® products seamlessly deliver
voice, video, data and multimedia connectivity in the home, office
and mobile environments. With one of the industry's broadest
portfolio of state-of-the-art system-on-a-chip solutions, Broadcom
is changing the world by connecting everything®. For more
information, go to www.broadcom.com.
Broadcom®, the pulse logo, StrataDNX, Tomahawk,
Connecting everything® and the Connecting everything logo
are among the trademarks of Broadcom Corporation and/or its
affiliates in the United States,
certain other countries and/or the EU. Any other trademarks
or trade names mentioned are the property of their respective
owners.
Contacts
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Press
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Investors
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Jyotsna Grover
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T. Peter Andrew
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Sameer Desai
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Manager, Public Relations
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Vice President, Treasury & Investor
Relations
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Director, Investor Relations
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408-919-4274
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949-926-6932
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949-926-4425
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jyotsna.grover@broadcom.com
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andrewtp@broadcom.com
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sameerd@broadcom.com
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SOURCE Broadcom Corporation; BRCM Infrastructure